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- Manufacturer No：AX125-FGG324I
- Manufacturer：Microsemi Corporation
- Category：Embedded - FPGAs (Field Programmable Gate Array)
- Datasheet：AX125-FGG324I
- SKU：3936565
- Description：CMOS 2005 RoHS Compliant BALL field programmable gate array -40C~85C TA 2.3kB 990ps 649MHz
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User Guide
AX125-FGG324I Details
CMOS 2005 RoHS Compliant BALL field programmable gate array -40C~85C TA 2.3kB 990ps 649MHz
AX125-FGG324I Specification Parameters
- Mounting Type: Surface Mount
- RoHS Status: RoHS Compliant
- Part Status: Obsolete
- Number of LABs/CLBs: 2016
- Peak Reflow Temperature (Cel): 260
- Time@Peak Reflow Temperature-Max (s): 40
- Operating Temperature: -40°C~85°C TA
- HTS Code: 8542.39.00.01
- Terminal Position: BOTTOM
- JESD-609 Code: e1
- Operating Supply Voltage: 1.5V
- Subcategory: Field Programmable Gate Arrays
- Width: 19mm
- Weight: 400.011771mg
- Number of Terminations: 324
- Number of I/O: 168
- Lifecycle Status: OBSOLETE (Last Updated: 3 weeks ago)
- RAM Size: 2.3kB
- Number of Gates: 125000
- Propagation Delay: 990 ps
- Frequency: 649MHz
- Power Supplies: 1.51.5/3.32.5/3.3V
- Base Part Number: AX125
- Mount: Surface Mount
- Radiation Hardening: No
- Packaging: Tray
- Technology: CMOS
- Moisture Sensitivity Level (MSL): 3 (168 Hours)
- Published: 2005
- Terminal Pitch: 1mm
- Height: 1.25mm
- Terminal Form: BALL
- Supply Voltage: 1.5V
- Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
- Length: 19mm
- Terminal Finish: TIN SILVER COPPER
- Voltage - Supply: 1.425V~1.575V
- Number of Pins: 324
- Number of Outputs: 168
- Total RAM Bits: 18432
- Series: Axcelerator
- Package / Case: 324-BGA
- Turn On Delay Time: 990 ps
- Combinatorial Delay of a CLB-Max: 0.99 ns
- Number of Registers: 1344
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Microsemi Corporation — Manufacturer Introduction
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services.
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