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JAN2N4957UB123
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JAN2N4957UB
  • Manufacturer No:
    JAN2N4957UB
  • Manufacturer:
    Microsemi Corporation
  • Category:
    Transistors - Bipolar (BJT) - RF
  • Datasheet:
    JAN2N4957UB
  • SKU:
    5576625
  • Description:
    Bulk Surface Mount PNP SINGLE RF Transistor 30 @ 5mA 10V 30mA 200mW 25dB

JAN2N4957UB Details

Bulk Surface Mount PNP SINGLE RF Transistor 30 @ 5mA 10V 30mA 200mW 25dB

JAN2N4957UB Specification Parameters

  • Part Status: Active
  • Packaging: Bulk
  • Number of Elements: 1
  • RoHS Status: Non-RoHS Compliant
  • Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED
  • JESD-609 Code: e4
  • Number of Terminations: 3
  • Published: 2007
  • Configuration: Single
  • Terminal Finish: Gold (Au) - with Nickel (Ni) barrier
  • Current - Collector (Ic) (Max): 30mA
  • Transistor Type: PNP
  • Qualification Status: Qualified
  • HTS Code: 8541.21.00.95
  • Operating Temperature: -65°C~200°C TJ
  • Collector-Base Capacitance-Max: 0.8pF
  • Gain: 25dB
  • JESD-30 Code: R-CDSO-N3
  • Lifecycle Status: IN PRODUCTION (Last Updated: 6 months ago)
  • Moisture Sensitivity Level (MSL): 1 (Unlimited)
  • Mounting Type: Surface Mount
  • ECCN Code: EAR99
  • Surface Mount: YES
  • Peak Reflow Temperature (Cel): NOT SPECIFIED
  • Terminal Position: DUAL
  • Pin Count: 3
  • Transistor Element Material: SILICON
  • Voltage - Collector Emitter Breakdown (Max): 30V
  • Power - Max: 200mW
  • Factory Lead Time: 23 Weeks
  • Polarity/Channel Type: PNP
  • Transistor Application: AMPLIFIER
  • Additional Feature: LOW NOISE
  • Package / Case: 3-SMD, No Lead
  • Highest Frequency Band: ULTRA HIGH FREQUENCY B
  • DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA 10V
  • Noise Figure (dB Typ @ f): 3.5dB @ 450MHz
  • Reference Standard: MIL-19500/426

Microsemi Corporation — Manufacturer Introduction

Microsemi Corporation
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services.

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