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- Manufacturer No：M1A3PE3000L-1FGG484M
- Manufacturer：Microsemi Corporation
- Category：Embedded - FPGAs (Field Programmable Gate Array)
- Datasheet：M1A3PE3000L-1FGG484M
- SKU：11194666
- Description：ProASIC3L M1A3PE3000L 484-BGA Tin/Silver/Copper (Sn/Ag/Cu) field programmable gate array 2.44mm 1.2/1.51.2/3.3V 250MHz 63kB
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User Guide
M1A3PE3000L-1FGG484M Details
ProASIC3L M1A3PE3000L 484-BGA Tin/Silver/Copper (Sn/Ag/Cu) field programmable gate array 2.44mm 1.2/1.51.2/3.3V 250MHz 63kB
M1A3PE3000L-1FGG484M Specification Parameters
- Part Status: Active
- Mount: Surface Mount
- Factory Lead Time: 12 Weeks
- Qualification Status: Not Qualified
- Moisture Sensitivity Level (MSL): 3 (168 Hours)
- Published: 2009
- HTS Code: 8542.39.00.01
- Terminal Form: BALL
- Supply Voltage: 1.2V
- Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
- Clock Frequency: 250MHz
- Length: 23mm
- Number of Terminations: 484
- Voltage - Supply: 1.425V~1.575V
- Height Seated (Max): 2.44mm
- JESD-30 Code: S-PBGA-B484
- Total RAM Bits: 516096
- RAM Size: 63kB
- Number of Outputs: 341
- Series: ProASIC3L
- Number of CLBs: 75264
- Power Supplies: 1.2/1.51.2/3.3V
- Mounting Type: Surface Mount
- RoHS Status: RoHS Compliant
- Packaging: Tray
- Technology: CMOS
- Time@Peak Reflow Temperature-Max (s): 40
- Terminal Pitch: 1mm
- Terminal Position: BOTTOM
- JESD-609 Code: e1
- Lifecycle Status: IN PRODUCTION (Last Updated: 1 month ago)
- Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
- Subcategory: Field Programmable Gate Arrays
- Width: 23mm
- Peak Reflow Temperature (Cel): 250
- Package / Case: 484-BGA
- Operating Temperature: -55°C~125°C TJ
- ECCN Code: 3A001.A.2.C
- Number of Gates: 3000000
- Number of I/O: 341
- Number of Inputs: 341
- Number of Logic Cells: 75264
- Base Part Number: M1A3PE3000L
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Microsemi Corporation — Manufacturer Introduction
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services.
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