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M2GL050-1FG484I123
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M2GL050-1FG484I
  • Manufacturer No:
    M2GL050-1FG484I
  • Manufacturer:
    Microsemi Corporation
  • Category:
    Embedded - FPGAs (Field Programmable Gate Array)
  • Datasheet:
    M2GL050-1FG484I
  • SKU:
    11288612
  • Description:
    IGLOO2 M2GL050 484-BGA Tin/Lead (Sn/Pb) field programmable gate array 2.44mm 1.2V 228.3kB -40C~100C TJ

M2GL050-1FG484I Details

IGLOO2 M2GL050 484-BGA Tin/Lead (Sn/Pb) field programmable gate array 2.44mm 1.2V 228.3kB -40C~100C TJ

M2GL050-1FG484I Specification Parameters

  • Part Status: Active
  • RoHS Status: Non-RoHS Compliant
  • Packaging: Tray
  • Lead Free: Contains Lead
  • JESD-609 Code: e0
  • Moisture Sensitivity Level (MSL): 3 (168 Hours)
  • Terminal Finish: Tin/Lead (Sn/Pb)
  • HTS Code: 8542.39.00.01
  • Terminal Form: BALL
  • Supply Voltage: 1.2V
  • Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
  • Lifecycle Status: IN PRODUCTION (Last Updated: 3 weeks ago)
  • Width: 23mm
  • Number of Terminations: 484
  • Height Seated (Max): 2.44mm
  • Series: IGLOO2
  • Number of Outputs: 267
  • Voltage - Supply: 1.14V~2.625V
  • Number of Logic Elements/Cells: 56340
  • RAM Size: 228.3kB
  • Mounting Type: Surface Mount
  • Surface Mount: YES
  • Published: 2013
  • Qualification Status: Not Qualified
  • Time@Peak Reflow Temperature-Max (s): 20
  • Factory Lead Time: 9 Weeks
  • Terminal Pitch: 1mm
  • Terminal Position: BOTTOM
  • Peak Reflow Temperature (Cel): 240
  • Power Supplies: 1.2V
  • Subcategory: Field Programmable Gate Arrays
  • Length: 23mm
  • Operating Temperature: -40°C~100°C TJ
  • Package / Case: 484-BGA
  • JESD-30 Code: S-PBGA-B484
  • Number of I/O: 267
  • Number of Inputs: 267
  • Total RAM Bits: 1869824
  • Base Part Number: M2GL050

Microsemi Corporation — Manufacturer Introduction

Microsemi Corporation
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services.

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