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BAL-NRF01D3123
  • Manufacturer No:
    BAL-NRF01D3
  • Manufacturer:
  • Category:
    Balun
  • Datasheet:
    Get the PDF file
  • SKU:
    4584531
  • Description:
    Signal Conditioning 50ohm balun Trans 2G45 ISM
  • Quantity:
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Inventory:270578
  • Qty Unit Price price
  • 1 $0.407 $0.407
  • 10 $0.402 $4.02
  • 100 $0.398 $39.8
  • 1000 $0.394 $394
  • 10000 $0.39 $3900

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BAL-NRF01D3
  • Manufacturer No:
    BAL-NRF01D3
  • Manufacturer:
    STMicroelectronics
  • Category:
    Balun
  • Datasheet:
    BAL-NRF01D3
  • SKU:
    4584531
  • Description:
    Signal Conditioning 50ohm balun Trans 2G45 ISM

BAL-NRF01D3 Details

Signal Conditioning 50ohm balun Trans 2G45 ISM

BAL-NRF01D3 Specification Parameters

  • Part Status: Active
  • Moisture Sensitivity Level (MSL): 1 (Unlimited)
  • Mount: Surface Mount
  • ECCN Code: EAR99
  • Lead Free: Lead Free
  • Min Operating Temperature: -40°C
  • REACH SVHC: No SVHC
  • Number of Pins: 5
  • Power Rating: 250mW
  • Case Code (Imperial): 1206
  • Case Code (Metric): 3216
  • Impedance: 50Ohm
  • Width: 1.6002mm
  • Height: 609.6μm
  • Resistance: 1kOhm
  • Lifecycle Status: ACTIVE (Last Updated: 8 months ago)
  • Transformer Type: RF TRANSFORMER
  • Phase Difference:
  • Package / Case: 5-WFBGA, FCBGA
  • Frequency Range: 2.4GHz~2.54GHz
  • RoHS Status: ROHS3 Compliant
  • Mounting Type: Surface Mount
  • Packaging: Tape & Reel (TR)
  • Radiation Hardening: No
  • Voltage - Rated: 50V
  • Termination: SMD/SMT
  • Shielding: Unshielded
  • Max Operating Temperature: 85°C
  • Tolerance: 5%
  • Factory Lead Time: 11 Weeks
  • JESD-609 Code: e1
  • Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
  • Length: 3.2004mm
  • Contact Plating: Copper, Silver, Tin
  • Frequency: 2.4GHz
  • Return Loss-Min: 10dB
  • Depth: 1.01mm
  • Impedance - Unbalanced/Balanced: 50 / -Ohm
  • Insertion Loss (dB): 2.25 dB

STMicroelectronics — Manufacturer Introduction

STMicroelectronics
STMicroelectronics is a global independent semiconductor company and is a leader in developing and delivering semiconductor solutions across the spectrum of microelectronics applications. An unrivaled combination of silicon and system expertise, manufacturing strength, Intellectual Property (IP) portfolio and strategic partners positions the Company at the forefront of System-on-Chip (SoC) technology and its products play a key role in enabling today's convergence trends.

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