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CL05B822KB5NNNC123
  • Manufacturer No:
    CL05B822KB5NNNC
  • Manufacturer:
  • Category:
    Ceramic Capacitors
  • Datasheet:
    Get the PDF file
  • SKU:
    9436249
  • Description:
    CL 0402 (1005Metric) Ceramic Capacitor 0.039Lx0.020W 1.00mmx0.50mm X7R ±10% 8200pF
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CL05B822KB5NNNC
  • Manufacturer No:
    CL05B822KB5NNNC
  • Manufacturer:
    Samsung
  • Category:
    Ceramic Capacitors
  • Datasheet:
    CL05B822KB5NNNC
  • SKU:
    9436249
  • Description:
    CL 0402 (1005Metric) Ceramic Capacitor 0.039Lx0.020W 1.00mmx0.50mm X7R ±10% 8200pF

CL05B822KB5NNNC Details

CL 0402 (1005Metric) Ceramic Capacitor 0.039Lx0.020W 1.00mmx0.50mm X7R ±10% 8200pF

CL05B822KB5NNNC Specification Parameters

  • Part Status: Active
  • Moisture Sensitivity Level (MSL): 1 (Unlimited)
  • Mount: Surface Mount
  • ECCN Code: EAR99
  • Radiation Hardening: No
  • Lead Free: Lead Free
  • Terminal Shape: WRAPAROUND
  • Mounting Type: Surface Mount, MLCC
  • Voltage - Rated DC: 50V
  • Terminal Finish: Matte Tin (Sn) - with Nickel (Ni) barrier
  • Temperature Coefficient: X7R
  • Material: Ceramic
  • Factory Lead Time: 18 Weeks
  • Width: 0.5mm
  • Case Code (Imperial): 0402
  • HTS Code: 8532.24.00.20
  • Height: 500μm
  • Case Code (Metric): 1005
  • Capacitance: 8200pF
  • Packing Method: TR, CARDBOARD PAPER, 7 INCH
  • RoHS Status: ROHS3 Compliant
  • Number of Terminations: 2
  • Packaging: Tape & Reel (TR)
  • Pbfree Code: yes
  • JESD-609 Code: e3
  • Operating Temperature: -55°C~125°C
  • Applications: General Purpose
  • Multilayer: Yes
  • Voltage: 50V
  • Tolerance: ±10%
  • Temperature Characteristics Code: X7R
  • Published: 2006
  • Thickness (Max): 0.022 0.55mm
  • Package / Case: 0402 (1005 Metric)
  • Length: 1mm
  • Size / Dimension: 0.039Lx0.020W 1.00mmx0.50mm
  • Depth: 500μm
  • Thickness: 558.8μm
  • Series: CL

Samsung — Manufacturer Introduction

Samsung
Samsung Electro Mechanics (SEMCO) is a leading supplier of a wide range of high-performance electronics components. Since 1973, SEMCO is driving the edge of miniaturization for increasingly challenged industrial designs of end products without compromising the quality and performance.

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