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BNC5-P-C-HN-ST-CA1123
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BNC5-P-C-HN-ST-CA1
  • Manufacturer No:
    BNC5-P-C-HN-ST-CA1
  • Manufacturer:
    Samtec Inc.
  • Category:
    Coaxial Connectors (RF)
  • Datasheet:
    BNC5-P-C-HN-ST-CA1
  • SKU:
    2601879
  • Description:
    Coaxial Connector

BNC5-P-C-HN-ST-CA1 Details

Coaxial Connector

BNC5-P-C-HN-ST-CA1 Specification Parameters

  • Part Status: Active
  • IEC Conformance: NO
  • MIL Conformance: NO
  • RoHS Status: ROHS3 Compliant
  • ECCN Code: EAR99
  • Center Contact Plating: Gold
  • Contact Termination: Solder
  • Option: GENERAL PURPOSE
  • Shield Termination: Crimp
  • Mounting Type: Free Hanging (In-Line)
  • Fastening Type: Bayonet Lock
  • Operating Temperature: -65°C~125°C
  • Voltage - Rated: 500V
  • Dielectric Material: Polytetrafluoroethylene (PTFE)
  • Frequency: 4GHz
  • Insulation Material: POLYTETRAFLUORO ETHYLENE
  • Includes: 5 pcs - 1 Connector, 1 Contact, 2 Ferrules, 1 Insulator
  • DIN Conformance: NO
  • Filter Feature: NO
  • Panel Mount: NO
  • Number of Ports: 1
  • Pbfree Code: yes
  • Moisture Sensitivity Level (MSL): Not Applicable
  • Factory Lead Time: 3 Weeks
  • JESD-609 Code: e4
  • Housing Color: Silver
  • Published: 2010
  • Body Material: Brass
  • Body Finish: Nickel
  • Impedance: 50Ohm
  • Connector Type: Plug, Male Pin
  • Connector Style: BNC
  • Cable Group: RG-174, 316

Samtec Inc. — Manufacturer Introduction

Samtec Inc.
Samtec is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed). To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.

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