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ERF8-005-05.0-L-DV-TR123
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ERF8-005-05.0-L-DV-TR
  • Manufacturer No:
    ERF8-005-05.0-L-DV-TR
  • Manufacturer:
    Samtec Inc.
  • Category:
    Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board)
  • Datasheet:
    ERF8-005-05.0-L-DV-TR
  • SKU:
    2077829
  • Description:
    Conn Micro High Speed Socket Strip SKT 10 POS 0.8mm Solder ST SMD T/R

ERF8-005-05.0-L-DV-TR Details

Conn Micro High Speed Socket Strip SKT 10 POS 0.8mm Solder ST SMD T/R

ERF8-005-05.0-L-DV-TR Specification Parameters

  • Part Status: Active
  • Moisture Sensitivity Level (MSL): 1 (Unlimited)
  • Number Of PCB Rows: 2
  • Packaging: Tape & Reel (TR)
  • JESD-609 Code: e3
  • Housing Color: Black
  • Factory Lead Time: 3 Weeks
  • Max Operating Temperature: 125°C
  • Number of Conductors: ONE
  • PCB Contact Pattern: RECTANGULAR
  • Subcategory: Headers and Edge Type Connectors
  • Max Voltage Rating (AC): 200V
  • Total Number of Contacts: 10
  • Orientation: Straight
  • Contact Material: Copper
  • Polarization Key: POLARIZED HOUSING
  • Housing Material: Polymer
  • Contact Style: BELLOWED TYPE
  • Depth: 5.6mm
  • PCB Contact Row Spacing: 4.4958 mm
  • Stack Height (Mating): 7mm 10mm 13mm 14mm 20mm
  • RoHS Status: ROHS3 Compliant
  • Number of Rows: 2
  • Mounting Type: Surface Mount
  • Radiation Hardening: No
  • Contact Finish: Gold
  • Termination: Solder
  • Min Operating Temperature: -55°C
  • Reliability: COMMERCIAL
  • Contact Finish Thickness: 10.0μin 0.25μm
  • Contact Pattern: RECTANGULAR
  • Gender: Receptacle
  • Number of Positions: 10
  • Reference Standard: UL
  • Pitch: 0.031 0.80mm
  • Length: 10mm
  • Mounting Option 1: LOCKING
  • Feature: Board Guide
  • Height Above Board: 0.210 5.33mm
  • Connector Type: Socket, Outer Shroud Contacts
  • Series: Edge Rate? ERF8

Samtec Inc. — Manufacturer Introduction

Samtec Inc.
Samtec is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed). To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.

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