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ERF8-035-07.0-S-DV-K-TR123
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ERF8-035-07.0-S-DV-K-TR
  • Manufacturer No:
    ERF8-035-07.0-S-DV-K-TR
  • Manufacturer:
    Samtec Inc.
  • Category:
    Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board)
  • Datasheet:
    ERF8-035-07.0-S-DV-K-TR
  • SKU:
    1651282
  • Description:
    .8MM EDGE RATE SOCKET ASSEMBLY

ERF8-035-07.0-S-DV-K-TR Details

.8MM EDGE RATE SOCKET ASSEMBLY

ERF8-035-07.0-S-DV-K-TR Specification Parameters

  • Part Status: Active
  • Moisture Sensitivity Level (MSL): 1 (Unlimited)
  • Number Of PCB Rows: 2
  • Packaging: Tape & Reel (TR)
  • Contact Finish: Gold
  • Factory Lead Time: 3 Weeks
  • Reliability: COMMERCIAL
  • PCB Contact Pattern: RECTANGULAR
  • Insulation Material: Liquid Crystal Polymer (LCP)
  • Contact Finish Thickness: 30.0μin 0.76μm
  • HTS Code: 8536.69.40.40
  • Pitch: 0.031 0.80mm
  • Plating Thickness: 30μin
  • Mounting Option 1: LOCKING
  • Total Number of Contacts: 70
  • Contact Style: BELLOWED TYPE
  • Connector Type: Socket, Outer Shroud Contacts
  • Series: Edge Rate? ERF8
  • Stack Height (Mating): 9mm 12mm 15mm 16mm 22mm
  • RoHS Status: ROHS3 Compliant
  • Number of Rows: 2
  • Mounting Type: Surface Mount
  • ECCN Code: EAR99
  • Insulator Color: Black
  • Operating Temperature (Min): -55°C
  • Number of Conductors: ONE
  • Contact Pattern: RECTANGULAR
  • Subcategory: Headers and Edge Type Connectors
  • Gender: Receptacle
  • Reference Standard: UL
  • Contact Material: Beryllium Copper
  • Polarization Key: POLARIZED HOUSING
  • Number of Positions: 70
  • Feature: Board Guide, Pick and Place
  • Height Above Board: 0.285 7.24mm
  • PCB Contact Row Spacing: 4.4958 mm
  • Body Length or Diameter: 1.339 inch

Samtec Inc. — Manufacturer Introduction

Samtec Inc.
Samtec is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed). To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.

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