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FFSD-20-D-04.00-01-N123
  • Manufacturer No:
    FFSD-20-D-04.00-01-N
  • Manufacturer:
  • Category:
    Rectangular Cable Assemblies
  • Datasheet:
    Get the PDF file
  • SKU:
    1710957
  • Description:
    Cable Assembly Flat Ribbon 0.101m 30AWG IDC Connector to IDC Connector 40 to 40 POS F-F IDT-IDT Bulk
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FFSD-20-D-04.00-01-N
  • Manufacturer No:
    FFSD-20-D-04.00-01-N
  • Manufacturer:
    Samtec Inc.
  • Category:
    Rectangular Cable Assemblies
  • Datasheet:
    FFSD-20-D-04.00-01-N
  • SKU:
    1710957
  • Description:
    Cable Assembly Flat Ribbon 0.101m 30AWG IDC Connector to IDC Connector 40 to 40 POS F-F IDT-IDT Bulk

FFSD-20-D-04.00-01-N Details

Cable Assembly Flat Ribbon 0.101m 30AWG IDC Connector to IDC Connector 40 to 40 POS F-F IDT-IDT Bulk

FFSD-20-D-04.00-01-N Specification Parameters

  • Part Status: Active
  • Moisture Sensitivity Level (MSL): 1 (Unlimited)
  • Packaging: Bulk
  • Radiation Hardening: No
  • Contact Finish: Gold
  • Contact Finish Thickness: 10.0μin 0.25μm
  • Shielding: Unshielded
  • Factory Lead Time: 4 Weeks
  • Pitch - Connector: 0.050 1.27mm
  • Contact Material: Copper
  • Max Current Rating: 500mA
  • Wire/Cable Type: Flat
  • Wire/Cable Gauge: 30 AWG
  • Color: Gray, Ribbon
  • Cable Length: 101mm
  • Connector Type A: Connector, IDC, Receptacle
  • Series: Tiger Eye? FFSD
  • RoHS Status: ROHS3 Compliant
  • Number of Rows: 2
  • Pbfree Code: yes
  • JESD-609 Code: e3
  • Min Operating Temperature: -40°C
  • REACH SVHC: No SVHC
  • Gender: Receptacle
  • Number of Positions: 40
  • Max Operating Temperature: 105°C
  • Cable Termination: IDC
  • Termination: IDT
  • Connector Type: Socket to Socket
  • Pitch - Cable: 0.025 0.64mm
  • Feature: Polarizing Key
  • Length: 0.333' 101.60mm 4.00
  • Connector Type B: Connector, IDC, Receptacle

Samtec Inc. — Manufacturer Introduction

Samtec Inc.
Samtec is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed). To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.

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