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RSP-122811-01123
  • Manufacturer No:
    RSP-122811-01
  • Manufacturer:
  • Category:
    Coaxial Connectors (RF)
  • Datasheet:
    Get the PDF file
  • SKU:
    3517782
  • Description:
    CONN UMC RCPT STR 50 OHM SMD
  • Quantity:
      • RFQ
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  • Material flow:
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Inventory:5647
  • Qty Unit Price price
  • 1 $1.937 $1.937
  • 10 $1.917 $19.17
  • 100 $1.898 $189.8
  • 1000 $1.879 $1879
  • 10000 $1.86 $18600

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RSP-122811-01
  • Manufacturer No:
    RSP-122811-01
  • Manufacturer:
    Samtec Inc.
  • Category:
    Coaxial Connectors (RF)
  • Datasheet:
    RSP-122811-01
  • SKU:
    3517782
  • Description:
    CONN UMC RCPT STR 50 OHM SMD

RSP-122811-01 Details

CONN UMC RCPT STR 50 OHM SMD

RSP-122811-01 Specification Parameters

  • Part Status: Active
  • IEC Conformance: NO
  • MIL Conformance: NO
  • Moisture Sensitivity Level (MSL): 1 (Unlimited)
  • Mount: Surface Mount
  • Total Number of Contacts: 1
  • Contact Termination: Solder
  • Option: GENERAL PURPOSE
  • Center Contact Material: Phosphor Bronze
  • Reliability: COMMERCIAL
  • Packaging: Strip
  • Dielectric Material: Liquid Crystal Polymer (LCP)
  • Orientation: Straight
  • Depth: 3mm
  • Length: 3.1mm
  • VSWR: 1.5
  • Fastening Type: Snap-On
  • Subcategory: Other RF Connectors
  • Height: 1.44mm
  • DIN Conformance: NO
  • Filter Feature: NO
  • RoHS Status: ROHS3 Compliant
  • Mounting Type: Surface Mount
  • Number of Ports: 1
  • Radiation Hardening: No
  • Factory Lead Time: 3 Weeks
  • Gender: Female
  • Body Material: Phosphor Bronze
  • Package / Case: SMD/SMT
  • Voltage - Rated: 60V
  • Reference Standard: UL
  • Published: 2009
  • Impedance: 50Ohm
  • Frequency: 6GHz
  • Operating Temperature: -40°C~90°C
  • Contact Style: COAX
  • Connector Style: U.FL (UMCC), IPEX MHF1
  • Connector Type: Receptacle, Male Pin

Samtec Inc. — Manufacturer Introduction

Samtec Inc.
Samtec is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed). To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.

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