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SFSD-15-30-G-04.25-SL123
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SFSD-15-30-G-04.25-SL
  • Manufacturer No:
    SFSD-15-30-G-04.25-SL
  • Manufacturer:
    Samtec Inc.
  • Category:
    Rectangular Cable Assemblies
  • Datasheet:
    SFSD-15-30-G-04.25-SL
  • SKU:
    3520541
  • Description:
    Trans MOSFET N-CH 30V 7.4A 4-Pin(3+Tab) SOT-223 T/R

SFSD-15-30-G-04.25-SL Details

Trans MOSFET N-CH 30V 7.4A 4-Pin(3+Tab) SOT-223 T/R

SFSD-15-30-G-04.25-SL Specification Parameters

  • Part Status: Active
  • IEC Conformance: NO
  • Mixed Contacts: NO
  • RoHS Status: ROHS3 Compliant
  • Packaging: Bulk
  • Radiation Hardening: No
  • Moisture Sensitivity Level (MSL): Not Applicable
  • Option: GENERAL PURPOSE
  • Gender: Female
  • Number of Pins: 4
  • Contact Finish Thickness: 10.0μin 0.25μm
  • Shielding: Unshielded
  • Number of Positions: 30
  • Pitch - Connector: 0.050 1.27mm
  • Plating Thickness: 10μin
  • Mating Contact Row Spacing: 0.05 inch
  • Mounting Style: STRAIGHT
  • Operating Temperature (Min): -10°C
  • Color: Black, Individual
  • Connector Type: Socket to Individual Wire Leads
  • Package / Case: SOT-223
  • Length: 0.354' 107.95mm 4.25
  • DIN Conformance: NO
  • Filter Feature: NO
  • MIL Conformance: NO
  • Number of Rows: 2
  • Pbfree Code: yes
  • Contact Finish: Gold
  • Factory Lead Time: 3 Weeks
  • JESD-609 Code: e4
  • Cable Termination: Crimp
  • Reliability: COMMERCIAL
  • Contact Pattern: RECTANGULAR
  • Subcategory: Headers and Edge Type Connectors
  • Total Number of Contacts: 30
  • Contact Material: Beryllium Copper
  • Mating Contact Pitch: 0.05 inch
  • Contact Style: SQ PIN-SKT
  • Wire/Cable Type: Discrete
  • Operating Temperature (Max): 80°C
  • Series: Tiger Eye? SFSD
  • Feature: Friction Lock, Polarizing Key
  • Cable Length: 107mm

Samtec Inc. — Manufacturer Introduction

Samtec Inc.
Samtec is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed). To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.

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