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SNT-100-OR-G-H123
  • Manufacturer No:
    SNT-100-OR-G-H
  • Manufacturer:
  • Category:
    Shunts, Jumpers
  • Datasheet:
  • SKU:
    3354515
  • Description:
    Conn Shunt F 2 POS 2.54mm ST
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SNT-100-OR-G-H
  • Manufacturer No:
    SNT-100-OR-G-H
  • Manufacturer:
    Samtec Inc.
  • Category:
    Shunts, Jumpers
  • Datasheet:
    SNT-100-OR-G-H
  • SKU:
    3354515
  • Description:
    Conn Shunt F 2 POS 2.54mm ST

SNT-100-OR-G-H Details

Conn Shunt F 2 POS 2.54mm ST

SNT-100-OR-G-H Specification Parameters

  • RoHS Status: ROHS3 Compliant
  • Number of Contacts: 2
  • Number of Rows: 1
  • Radiation Hardening: No
  • Part Status: Obsolete
  • Pitch: 0.100 2.54mm
  • Reliability: COMMERCIAL
  • Number of Conductors: ONE
  • Depth: 2.54mm
  • Contact Pattern: RECTANGULAR
  • Published: 2010
  • Housing Material: Polybutylene Terephthalate (PBT)
  • Contact Style: SQ PIN-SKT
  • Color: Orange
  • Max Operating Temperature: 90°C
  • Height: 0.550 13.97mm
  • Insertion Force-Max: 8.896 N
  • Subcategory: Other Interconnects
  • Series: SNT
  • Moisture Sensitivity Level (MSL): 1 (Unlimited)
  • Packaging: Bulk
  • Pbfree Code: yes
  • Contact Finish: Gold
  • Material Flammability Rating: UL94 V-0
  • JESD-609 Code: e4
  • Min Operating Temperature: -40°C
  • Contact Finish Thickness: 10.0μin 0.25μm
  • REACH SVHC: No SVHC
  • Orientation: Straight
  • Length: 5.08mm
  • Contact Material: Bronze
  • Body/Shell Style: PLUG
  • Gender: Female Sockets
  • Additional Feature: GLASS FILLED POLYESTER
  • Contact Resistance: 5mOhm
  • Number of Positions or Pins (Grid): 2 (1 x 2)
  • Type: Open Top, Grip
  • Current Rating (Amps): 4.3A per Contact

Samtec Inc. — Manufacturer Introduction

Samtec Inc.
Samtec is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed). To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.

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