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  • Manufacturer No:
    XC17S10XLVOG8I
  • Manufacturer:
  • Category:
    Memory - Configuration Proms for FPGAs
  • Datasheet:
    Get the PDF file
  • SKU:
    5173034
  • Description:
    XC17S10XL Matte Tin (Sn) EAR99 Tray ics fpga configuration 3.9mm 0.00005A 100kb 3.3V
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  • Manufacturer No:
    XC17S10XLVOG8I
  • Manufacturer:
    Xilinx
  • Category:
    Memory - Configuration Proms for FPGAs
  • Datasheet:
    XC17S10XLVOG8I
  • SKU:
    5173034
  • Description:
    XC17S10XL Matte Tin (Sn) EAR99 Tray ics fpga configuration 3.9mm 0.00005A 100kb 3.3V

XC17S10XLVOG8I Details

XC17S10XL Matte Tin (Sn) EAR99 Tray ics fpga configuration 3.9mm 0.00005A 100kb 3.3V

XC17S10XLVOG8I Specification Parameters

  • Mounting Type: Surface Mount
  • Memory Width: 1
  • ECCN Code: EAR99
  • JESD-609 Code: e3
  • Number of Pins: 8
  • Pin Count: 8
  • Supply Voltage: 3.3V
  • Packaging: Tray
  • Qualification Status: Not Qualified
  • Technology: CMOS
  • Terminal Finish: Matte Tin (Sn)
  • Time@Peak Reflow Temperature-Max (s): 30
  • Terminal Pitch: 1.27mm
  • Height Seated (Max): 1.2mm
  • Width: 3.9mm
  • Output Characteristics: 3-STATE
  • Voltage - Supply: 3V~3.6V
  • Operating Mode: SYNCHRONOUS
  • Programmable Type: OTP
  • Standby Current-Max: 0.00005A
  • Memory Size: 100kB
  • Base Part Number: XC17S10XL
  • Number of Functions: 1
  • RoHS Status: RoHS Compliant
  • Surface Mount: YES
  • Part Status: Obsolete
  • Number of Terminations: 8
  • Terminal Position: DUAL
  • Power Supplies: 3.3V
  • Operating Temperature: -40°C~85°C
  • Terminal Form: GULL WING
  • Peak Reflow Temperature (Cel): 260
  • Moisture Sensitivity Level (MSL): 3 (168 Hours)
  • Supply Voltage-Min (Vsup): 3V
  • Supply Voltage-Max (Vsup): 3.6V
  • Package / Case: 8-SOIC (0.154, 3.90mm Width)
  • Length: 4.9mm
  • Published: 1999
  • Clock Frequency: 10MHz
  • I/O Type: COMMON
  • Supply Current-Max: 0.005mA
  • Memory IC Type: MEMORY CIRCUIT
  • Organization: 95752X1
  • Memory Density: 95752 bit

Xilinx — Manufacturer Introduction

Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.

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