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  • Manufacturer No:
    XC17S200AVO8I
  • Manufacturer:
  • Category:
    Memory - Configuration Proms for FPGAs
  • Datasheet:
    Get the PDF file
  • SKU:
    5166463
  • Description:
    XC17S200A EAR99 Tube 1999 ics fpga configuration 3.9mm 0.001A 2Mb 3.3V
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  • Manufacturer No:
    XC17S200AVO8I
  • Manufacturer:
    Xilinx
  • Category:
    Memory - Configuration Proms for FPGAs
  • Datasheet:
    XC17S200AVO8I
  • SKU:
    5166463
  • Description:
    XC17S200A EAR99 Tube 1999 ics fpga configuration 3.9mm 0.001A 2Mb 3.3V

XC17S200AVO8I Details

XC17S200A EAR99 Tube 1999 ics fpga configuration 3.9mm 0.001A 2Mb 3.3V

XC17S200AVO8I Specification Parameters

  • Moisture Sensitivity Level (MSL): 1 (Unlimited)
  • Number of Functions: 1
  • ECCN Code: EAR99
  • RoHS Status: Non-RoHS Compliant
  • Part Status: Obsolete
  • Number of Terminations: 8
  • Terminal Position: DUAL
  • Supply Voltage: 3.3V
  • Operating Temperature: -40°C~85°C
  • Lead Free: Contains Lead
  • Terminal Form: GULL WING
  • Time@Peak Reflow Temperature-Max (s): 30
  • Terminal Pitch: 1.27mm
  • Height Seated (Max): 1.2mm
  • Width: 3.9mm
  • Output Characteristics: 3-STATE
  • Voltage - Supply: 3V~3.6V
  • Parallel/Serial: SERIAL
  • Programmable Type: OTP
  • Memory Size: 2MB
  • Memory IC Type: CONFIGURATION MEMORY
  • Mounting Type: Surface Mount
  • Memory Width: 1
  • Radiation Hardening: No
  • Surface Mount: YES
  • Number of Pins: 8
  • Pin Count: 8
  • Packaging: Tube
  • Operating Supply Voltage: 3.3V
  • Pbfree Code: no
  • JESD-609 Code: e0
  • Technology: CMOS
  • Supply Voltage-Min (Vsup): 3V
  • Supply Voltage-Max (Vsup): 3.6V
  • Package / Case: 8-SOIC (0.154, 3.90mm Width)
  • Length: 4.9mm
  • Published: 1999
  • Peak Reflow Temperature (Cel): 225
  • I/O Type: COMMON
  • Supply Current-Max: 0.015mA
  • Standby Current-Max: 0.001A
  • Base Part Number: XC17S200A

Xilinx — Manufacturer Introduction

Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.

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