Add to like
Add to project list
- Home >
- Manufacturer No：
- Manufacturer：
- Category：
- Datasheet：
- SKU：
- Description：
- Quantity：
- RFQ
Add To Cart
- Material flow:
- Payment:
Inventory:0
- Qty Unit Price price
Not the price you want? Send RFQ Now and we'll contact you ASAP
- Manufacturer No：XC17S200AVOG8I
- Manufacturer：Xilinx
- Category：Memory - Configuration Proms for FPGAs
- Datasheet：XC17S200AVOG8I
- SKU：5169427
- Description：XC17S200A Matte Tin (Sn) EAR99 Tray ics fpga configuration 3.9mm 0.001A 2Mb 3.3V
User Guide
User Guide
XC17S200AVOG8I Details
XC17S200A Matte Tin (Sn) EAR99 Tray ics fpga configuration 3.9mm 0.001A 2Mb 3.3V
XC17S200AVOG8I Specification Parameters
- Mounting Type: Surface Mount
- Memory Width: 1
- ECCN Code: EAR99
- Radiation Hardening: No
- JESD-609 Code: e3
- Number of Pins: 8
- Pin Count: 8
- Supply Voltage: 3.3V
- Packaging: Tray
- Terminal Form: GULL WING
- Peak Reflow Temperature (Cel): 260
- Moisture Sensitivity Level (MSL): 3 (168 Hours)
- Supply Voltage-Min (Vsup): 3V
- Supply Voltage-Max (Vsup): 3.6V
- Package / Case: 8-SOIC (0.154, 3.90mm Width)
- Length: 4.9mm
- Published: 1999
- Parallel/Serial: SERIAL
- Programmable Type: OTP
- Memory Size: 2MB
- Memory IC Type: CONFIGURATION MEMORY
- Number of Functions: 1
- RoHS Status: RoHS Compliant
- Pbfree Code: yes
- Surface Mount: YES
- Part Status: Obsolete
- Number of Terminations: 8
- Terminal Position: DUAL
- Operating Supply Voltage: 3.3V
- Operating Temperature: -40°C~85°C
- Technology: CMOS
- Terminal Finish: Matte Tin (Sn)
- Time@Peak Reflow Temperature-Max (s): 30
- Terminal Pitch: 1.27mm
- Height Seated (Max): 1.2mm
- Width: 3.9mm
- Output Characteristics: 3-STATE
- Voltage - Supply: 3V~3.6V
- I/O Type: COMMON
- Supply Current-Max: 0.015mA
- Standby Current-Max: 0.001A
- Base Part Number: XC17S200A
Search for similar products
XC17S200AVOG8I Similar Products
The four parts on the right have similar specifications to Xilinx & XC17S200AVOG8I
Xilinx — Manufacturer Introduction
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.
Hot Search
Excellent
Based on reviews
Excellent
Based on reviews
LKR uses cookies to help deliver a better online experience. You can see what cookies we server and how to set your preferences in our
Cookies Policy, if you agree on our use of cookies please click continue. When browsing and using our website, LKR also collects, stores and/or processes personal data,
please read our Term & Condition
and
Privacy Policy
to find out more.
About Us
Our social media
We support logistics
We Accept Payment Via
