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- Manufacturer No：XC17S30APD8C
- Manufacturer：Xilinx
- Category：Memory - Configuration Proms for FPGAs
- Datasheet：XC17S30APD8C
- SKU：5164196
- Description：XC17S30 EAR99 Tube 1999 ics fpga configuration 7.62mm 0.00005A 300kb 3.3V
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User Guide
XC17S30APD8C Details
XC17S30 EAR99 Tube 1999 ics fpga configuration 7.62mm 0.00005A 300kb 3.3V
XC17S30APD8C Specification Parameters
- Surface Mount: NO
- Mounting Type: Through Hole
- Memory Width: 1
- Radiation Hardening: No
- Part Status: Obsolete
- Number of Terminations: 8
- Terminal Position: DUAL
- Supply Voltage: 3.3V
- Pbfree Code: no
- JESD-609 Code: e0
- Technology: CMOS
- Supply Voltage-Min (Vsup): 3V
- Width: 7.62mm
- Output Characteristics: 3-STATE
- Voltage - Supply: 3V~3.6V
- Parallel/Serial: SERIAL
- Package / Case: 8-DIP (0.300, 7.62mm)
- Supply Current-Max: 0.005mA
- Standby Current-Max: 0.00005A
- Memory IC Type: CONFIGURATION MEMORY
- Memory Size: 300kb
- Moisture Sensitivity Level (MSL): 1 (Unlimited)
- Number of Functions: 1
- ECCN Code: EAR99
- RoHS Status: Non-RoHS Compliant
- Number of Pins: 8
- Pin Count: 8
- Packaging: Tube
- Operating Supply Voltage: 3.3V
- Lead Free: Contains Lead
- Terminal Pitch: 2.54mm
- Time@Peak Reflow Temperature-Max (s): 30
- Supply Voltage-Max (Vsup): 3.6V
- Operating Temperature: 0°C~70°C
- Published: 1999
- Peak Reflow Temperature (Cel): 225
- I/O Type: COMMON
- Programmable Type: OTP
- Height Seated (Max): 4.5974mm
- Density: 512 kb
- Length: 9.3599mm
- Base Part Number: XC17S30
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Xilinx — Manufacturer Introduction
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.
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