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XC2S100E-6FG456I123
  • Manufacturer No:
    XC2S100E-6FG456I
  • Manufacturer:
  • Category:
    Embedded - FPGAs (Field Programmable Gate Array)
  • Datasheet:
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  • SKU:
    13263957
  • Description:
    CMOS Non-RoHS Compliant BALL BOTTOM field programmable gate array 100C 5kB 0.47ns 357MHz
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XC2S100E-6FG456I
  • Manufacturer No:
    XC2S100E-6FG456I
  • Manufacturer:
    Xilinx
  • Category:
    Embedded - FPGAs (Field Programmable Gate Array)
  • Datasheet:
    XC2S100E-6FG456I
  • SKU:
    13263957
  • Description:
    CMOS Non-RoHS Compliant BALL BOTTOM field programmable gate array 100C 5kB 0.47ns 357MHz

XC2S100E-6FG456I Details

CMOS Non-RoHS Compliant BALL BOTTOM field programmable gate array 100C 5kB 0.47ns 357MHz

XC2S100E-6FG456I Specification Parameters

  • ECCN Code: EAR99
  • RoHS Status: Non-RoHS Compliant
  • Moisture Sensitivity Level (MSL): 3
  • Speed Grade: 6
  • JESD-609 Code: e0
  • Time@Peak Reflow Temperature-Max (s): 30
  • Operating Supply Voltage: 1.8V
  • HTS Code: 8542.39.00.01
  • Terminal Form: BALL
  • Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
  • Peak Reflow Temperature (Cel): 225
  • Width: 23mm
  • Number of CLBs: 600
  • Number of Equivalent Gates: 37000
  • Pin Count: 456
  • Number of Logic Cells: 2700
  • Number of Inputs: 202
  • Combinatorial Delay of a CLB-Max: 0.47 ns
  • Radiation Hardening: No
  • Surface Mount: YES
  • Pbfree Code: no
  • Min Operating Temperature: -40°C
  • Technology: CMOS
  • Supply Voltage: 1.8V
  • Terminal Pitch: 1mm
  • Terminal Position: BOTTOM
  • Max Operating Temperature: 100°C
  • Subcategory: Field Programmable Gate Arrays
  • Length: 23mm
  • Supply Voltage-Max (Vsup): 1.89V
  • Package / Case: FBGA
  • Number of Terminations: 456
  • Clock Frequency: 357MHz
  • Number of Outputs: 202
  • RAM Size: 5kB
  • Additional Feature: MAXIMUM USABLE GATES = 100000

Xilinx — Manufacturer Introduction

Xilinx
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.

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