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- Manufacturer No：XC2S300E-6FTG256C
- Manufacturer：Xilinx
- Category：Embedded - FPGAs (Field Programmable Gate Array)
- Datasheet：XC2S300E-6FTG256C
- SKU：5169295
- Description：Spartan®-IIE XC2S300E 256-LBGA Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) field programmable gate array 2mm 1.8V 357MHz 0.47ns
User Guide
User Guide
XC2S300E-6FTG256C Details
Spartan®-IIE XC2S300E 256-LBGA Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) field programmable gate array 2mm 1.8V 357MHz 0.47ns
XC2S300E-6FTG256C Specification Parameters
- Mounting Type: Surface Mount
- RoHS Status: RoHS Compliant
- Pbfree Code: yes
- Lead Free: Lead Free
- Packaging: Tray
- Technology: CMOS
- Moisture Sensitivity Level (MSL): 3 (168 Hours)
- Height Seated (Max): 2mm
- Operating Supply Voltage: 1.8V
- HTS Code: 8542.39.00.01
- Terminal Position: BOTTOM
- JESD-609 Code: e1
- Subcategory: Field Programmable Gate Arrays
- Number of Pins: 256
- Length: 17mm
- Operating Temperature: 0°C~85°C TJ
- Total RAM Bits: 65536
- Voltage - Supply: 1.71V~1.89V
- Terminal Finish: Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
- Clock Frequency: 357MHz
- Number of Gates: 300000
- Number of Logic Elements/Cells: 6912
- Number of Equivalent Gates: 93000
- Mount: Surface Mount
- ECCN Code: EAR99
- Radiation Hardening: No
- Part Status: Obsolete
- Speed Grade: 6
- Peak Reflow Temperature (Cel): 260
- Time@Peak Reflow Temperature-Max (s): 30
- Supply Voltage: 1.8V
- Terminal Pitch: 1mm
- Published: 2001
- Terminal Form: BALL
- Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
- Number of Terminations: 256
- Pin Count: 256
- Width: 17mm
- RAM Size: 8kB
- Package / Case: 256-LBGA
- Number of I/O: 182
- Number of LABs/CLBs: 1536
- Number of Outputs: 329
- Combinatorial Delay of a CLB-Max: 0.47 ns
- Series: Spartan?-IIE
- Base Part Number: XC2S300E
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Xilinx — Manufacturer Introduction
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.
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