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- Manufacturer No：XC3S200AN-4FTG256C
- Manufacturer：Xilinx
- Category：Embedded - FPGAs (Field Programmable Gate Array)
- Datasheet：XC3S200AN-4FTG256C
- SKU：5165156
- Description：Spartan®-3AN XC3S200AN 256-LBGA Surface Mount field programmable gate array 1mm 1.2V 250MHz 0.71ns
User Guide
User Guide
XC3S200AN-4FTG256C Details
Spartan®-3AN XC3S200AN 256-LBGA Surface Mount field programmable gate array 1mm 1.2V 250MHz 0.71ns
XC3S200AN-4FTG256C Specification Parameters
- Part Status: Active
- Mounting Type: Surface Mount
- ECCN Code: EAR99
- Speed Grade: 4
- Factory Lead Time: 10 Weeks
- Termination: SMD/SMT
- Peak Reflow Temperature (Cel): 260
- Time@Peak Reflow Temperature-Max (s): 30
- REACH SVHC: Unknown
- Terminal Position: BOTTOM
- JESD-609 Code: e1
- Operating Supply Voltage: 1.2V
- Frequency: 250MHz
- Number of Terminations: 256
- Pin Count: 256
- Length: 17mm
- Operating Temperature: 0°C~85°C TJ
- Voltage - Supply: 1.14V~1.26V
- Number of I/O: 195
- Number of CLBs: 448
- Number of Gates: 200000
- Number of Logic Elements/Cells: 4032
- Combinatorial Delay of a CLB-Max: 0.71 ns
- Base Part Number: XC3S200AN
- RoHS Status: ROHS3 Compliant
- Mount: Surface Mount
- Pbfree Code: yes
- Packaging: Tray
- Qualification Status: Not Qualified
- Technology: CMOS
- Moisture Sensitivity Level (MSL): 3 (168 Hours)
- Published: 2007
- Height: 1mm
- Terminal Form: BALL
- Supply Voltage: 1.2V
- Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
- Subcategory: Field Programmable Gate Arrays
- Number of Pins: 256
- Contact Plating: Copper, Silver, Tin
- Width: 17mm
- Number of Outputs: 160
- Package / Case: 256-LBGA
- Power Supplies: 1.21.2/3.33.3V
- Number of LABs/CLBs: 448
- Total RAM Bits: 294912
- RAM Size: 36kB
- Series: Spartan?-3AN
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Xilinx — Manufacturer Introduction
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.
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