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- Manufacturer No：XC3S400AN-4FT256C
- Manufacturer：Xilinx
- Category：Embedded - FPGAs (Field Programmable Gate Array)
- Datasheet：XC3S400AN-4FT256C
- SKU：5166305
- Description：Spartan®-3AN XC3S400AN 256-LBGA Tin/Lead (Sn63Pb37) field programmable gate array 1.55mm 1.2V 667MHz 4.88ns
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User Guide
XC3S400AN-4FT256C Details
Spartan®-3AN XC3S400AN 256-LBGA Tin/Lead (Sn63Pb37) field programmable gate array 1.55mm 1.2V 667MHz 4.88ns
XC3S400AN-4FT256C Specification Parameters
- Part Status: Active
- Mount: Surface Mount
- RoHS Status: Non-RoHS Compliant
- Packaging: Tray
- JESD-609 Code: e0
- Factory Lead Time: 16 Weeks
- Time@Peak Reflow Temperature-Max (s): 30
- Published: 2007
- Terminal Position: BOTTOM
- Peak Reflow Temperature (Cel): 240
- Operating Supply Voltage: 1.2V
- Subcategory: Field Programmable Gate Arrays
- Number of Pins: 256
- Terminal Finish: Tin/Lead (Sn63Pb37)
- Width: 17mm
- Number of Outputs: 160
- Voltage - Supply: 1.14V~1.26V
- Clock Frequency: 667MHz
- Number of Registers: 896
- Power Supplies: 1.21.2/3.33.3V
- Number of Logic Elements/Cells: 8064
- Total RAM Bits: 368640
- Series: Spartan?-3AN
- Propagation Delay: 4.88 ns
- Mounting Type: Surface Mount
- ECCN Code: EAR99
- Speed Grade: 4
- Qualification Status: Not Qualified
- Technology: CMOS
- Moisture Sensitivity Level (MSL): 3 (168 Hours)
- Reach Compliance Code: not_compliant
- Terminal Pitch: 1mm
- Terminal Form: BALL
- Supply Voltage: 1.2V
- Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
- Number of Terminations: 256
- Pin Count: 256
- Length: 17mm
- Operating Temperature: 0°C~85°C TJ
- Height Seated (Max): 1.55mm
- Package / Case: 256-LBGA
- Number of CLBs: 896
- Number of I/O: 195
- Number of Gates: 400000
- RAM Size: 45kB
- Combinatorial Delay of a CLB-Max: 0.71 ns
- Base Part Number: XC3S400AN
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Xilinx — Manufacturer Introduction
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.
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