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  • Manufacturer No:
    XC3S400AN-4FTG256I
  • Manufacturer:
    Xilinx
  • Category:
    Embedded - FPGAs (Field Programmable Gate Array)
  • Datasheet:
    XC3S400AN-4FTG256I
  • SKU:
    5165299
  • Description:
    CMOS 1999 ROHS3Compliant BALL FPGA -40C~100C TJ 45kB 4.88ns 667MHz

XC3S400AN-4FTG256I Details

CMOS 1999 ROHS3Compliant BALL FPGA -40C~100C TJ 45kB 4.88ns 667MHz

XC3S400AN-4FTG256I Specification Parameters

  • Part Status: Active
  • Mounting Type: Surface Mount
  • ECCN Code: EAR99
  • Packaging: Tray
  • Technology: CMOS
  • Peak Reflow Temperature (Cel): 260
  • Time@Peak Reflow Temperature-Max (s): 30
  • Terminal Position: BOTTOM
  • JESD-609 Code: e1
  • Operating Supply Voltage: 1.2V
  • Published: 1999
  • Subcategory: Field Programmable Gate Arrays
  • Number of Pins: 256
  • Length: 17mm
  • Operating Temperature: -40°C~100°C TJ
  • Height Seated (Max): 1.55mm
  • Package / Case: 256-LBGA
  • Number of CLBs: 896
  • Number of I/O: 195
  • Number of Gates: 400000
  • RAM Size: 45kB
  • Combinatorial Delay of a CLB-Max: 0.71 ns
  • Base Part Number: XC3S400AN
  • RoHS Status: ROHS3 Compliant
  • Mount: Surface Mount
  • Speed Grade: 4
  • Qualification Status: Not Qualified
  • Factory Lead Time: 16 Weeks
  • Moisture Sensitivity Level (MSL): 3 (168 Hours)
  • Terminal Pitch: 1mm
  • Terminal Form: BALL
  • Supply Voltage: 1.2V
  • Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
  • Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
  • Number of Terminations: 256
  • Pin Count: 256
  • Width: 17mm
  • Number of Outputs: 160
  • Voltage - Supply: 1.14V~1.26V
  • Clock Frequency: 667MHz
  • Number of Registers: 896
  • Power Supplies: 1.21.2/3.33.3V
  • Number of Logic Elements/Cells: 8064
  • Total RAM Bits: 368640
  • Series: Spartan?-3AN
  • Propagation Delay: 4.88 ns

Xilinx — Manufacturer Introduction

Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.

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