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- Manufacturer No：XC4VLX40-10FFG668C
- Manufacturer：Xilinx
- Category：Embedded - FPGAs (Field Programmable Gate Array)
- Datasheet：XC4VLX40-10FFG668C
- SKU：5165196
- Description：Virtex®-4LX XC4VLX40 668-BBGA FCBGA Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) field programmable gate array 2.85mm 1.2V 400MHz 216kB
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User Guide
XC4VLX40-10FFG668C Details
Virtex®-4LX XC4VLX40 668-BBGA FCBGA Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) field programmable gate array 2.85mm 1.2V 400MHz 216kB
XC4VLX40-10FFG668C Specification Parameters
- Part Status: Active
- Mounting Type: Surface Mount
- Pbfree Code: yes
- Packaging: Tray
- Qualification Status: Not Qualified
- Technology: CMOS
- Time@Peak Reflow Temperature-Max (s): 30
- REACH SVHC: Unknown
- HTS Code: 8542.39.00.01
- Terminal Form: BALL
- Supply Voltage: 1.2V
- Published: 1999
- Subcategory: Field Programmable Gate Arrays
- Moisture Sensitivity Level (MSL): 4 (72 Hours)
- Frequency: 400MHz
- Width: 27mm
- ECCN Code: 3A991.D
- Height Seated (Max): 2.85mm
- Number of Outputs: 448
- Pin Count: 668
- Series: Virtex?-4 LX
- RAM Size: 216kB
- Number of Logic Elements/Cells: 41472
- Base Part Number: XC4VLX40
- RoHS Status: ROHS3 Compliant
- Mount: Surface Mount
- Lead Free: Lead Free
- Factory Lead Time: 10 Weeks
- Termination: SMD/SMT
- Speed Grade: 10
- Reach Compliance Code: not_compliant
- Terminal Pitch: 1mm
- Terminal Position: BOTTOM
- JESD-609 Code: e1
- Operating Supply Voltage: 1.2V
- Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
- Peak Reflow Temperature (Cel): 245
- Operating Temperature: 0°C~85°C TJ
- Length: 27mm
- Voltage - Supply: 1.14V~1.26V
- Terminal Finish: Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
- Number of I/O: 448
- Number of Terminations: 668
- Number of Pins: 668
- Number of LABs/CLBs: 4608
- Total RAM Bits: 1769472
- Package / Case: 668-BBGA, FCBGA
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Xilinx — Manufacturer Introduction
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.
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