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- Manufacturer No：XC6SLX100-L1FG676C
- Manufacturer：Xilinx
- Category：Embedded - FPGAs (Field Programmable Gate Array)
- Datasheet：XC6SLX100-L1FG676C
- SKU：5164715
- Description：Spartan®-6LX XC6SLX100 676-BBGA FCBGA Tin/Lead (Sn63Pb37) field programmable gate array 2.44mm 1V 0.46ns 603kB
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User Guide
XC6SLX100-L1FG676C Details
Spartan®-6LX XC6SLX100 676-BBGA FCBGA Tin/Lead (Sn63Pb37) field programmable gate array 2.44mm 1V 0.46ns 603kB
XC6SLX100-L1FG676C Specification Parameters
- Part Status: Active
- Mount: Surface Mount
- Packaging: Tray
- Factory Lead Time: 10 Weeks
- JESD-609 Code: e0
- Time@Peak Reflow Temperature-Max (s): 30
- Published: 2008
- HTS Code: 8542.39.00.01
- Terminal Form: BALL
- Operating Supply Voltage: 1V
- Subcategory: Field Programmable Gate Arrays
- Moisture Sensitivity Level (MSL): 4 (72 Hours)
- Operating Temperature: 0°C~85°C TJ
- Width: 27mm
- ECCN Code: 3A991.D
- Number of Terminations: 676
- Pin Count: 676
- Number of I/O: 480
- Series: Spartan?-6 LX
- Total RAM Bits: 4939776
- Number of LABs/CLBs: 7911
- Combinatorial Delay of a CLB-Max: 0.46 ns
- Base Part Number: XC6SLX100
- Mounting Type: Surface Mount
- RoHS Status: Non-RoHS Compliant
- Pbfree Code: no
- Qualification Status: Not Qualified
- Technology: CMOS
- Reach Compliance Code: not_compliant
- Terminal Pitch: 1mm
- Terminal Position: BOTTOM
- Supply Voltage: 1V
- Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
- Peak Reflow Temperature (Cel): 225
- Terminal Finish: Tin/Lead (Sn63Pb37)
- Length: 27mm
- Voltage - Supply: 1.14V~1.26V
- Height Seated (Max): 2.44mm
- Number of Pins: 676
- Number of Outputs: 480
- Package / Case: 676-BBGA, FCBGA
- RAM Size: 603kB
- Power Supplies: 12.5/3.3V
- Number of Logic Elements/Cells: 101261
- Number of Registers: 126576
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Xilinx — Manufacturer Introduction
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.
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