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XC7V585T-3FFG1157E123
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XC7V585T-3FFG1157E
  • Manufacturer No:
    XC7V585T-3FFG1157E
  • Manufacturer:
    Xilinx
  • Category:
    Embedded - FPGAs (Field Programmable Gate Array)
  • Datasheet:
    XC7V585T-3FFG1157E
  • SKU:
    13359222
  • Description:
    CMOS MILITARY RoHS Compliant BALL field programmable gate array 100C 3.5MB 0.58ns 1818MHz

XC7V585T-3FFG1157E Details

CMOS MILITARY RoHS Compliant BALL field programmable gate array 100C 3.5MB 0.58ns 1818MHz

XC7V585T-3FFG1157E Specification Parameters

  • RoHS Status: RoHS Compliant
  • Surface Mount: YES
  • Peak Reflow Temperature (Cel): NOT SPECIFIED
  • Qualification Status: Not Qualified
  • Terminal Pitch: 1mm
  • Terminal Position: BOTTOM
  • Terminal Form: BALL
  • Operating Supply Voltage: 1V
  • Max Operating Temperature: 100°C
  • Length: 35mm
  • Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
  • Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
  • Number of Outputs: 600
  • Package / Case: FCBGA
  • Height Seated (Max): 3.35mm
  • Supply Voltage-Max (Vsup): 1.03V
  • Number of Terminations: 1157
  • RAM Size: 3.5MB
  • Speed Grade: -3
  • Number of Logic Blocks (LABs): 45525
  • Number of Registers: 728400
  • Pbfree Code: yes
  • Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED
  • Moisture Sensitivity Level (MSL): 4
  • Technology: CMOS
  • HTS Code: 8542.39.00.01
  • Min Operating Temperature: 0°C
  • Supply Voltage: 1V
  • JESD-609 Code: e1
  • Temperature Grade: Military
  • Width: 35mm
  • Subcategory: Field Programmable Gate Arrays
  • Number of I/O: 600
  • Number of Inputs: 600
  • ECCN Code: 3A991.D
  • Power Supplies: 11.8V
  • Clock Frequency: 1818MHz
  • Pin Count: 1157
  • Combinatorial Delay of a CLB-Max: 0.58 ns
  • JESD-30 Code: S-PBGA-B1157
  • Number of Logic Elements/Cells: 582720

Xilinx — Manufacturer Introduction

Xilinx
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.

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