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- Manufacturer No：XC7V585T-3FFG1761E
- Manufacturer：Xilinx
- Category：Embedded - FPGAs (Field Programmable Gate Array)
- Datasheet：XC7V585T-3FFG1761E
- SKU：5170630
- Description：Virtex®-7T XC7V585T 1760-BBGA FCBGA Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) field programmable gate array 3.5mm 1V 1818MHz 0.58ns
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User Guide
XC7V585T-3FFG1761E Details
Virtex®-7T XC7V585T 1760-BBGA FCBGA Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) field programmable gate array 3.5mm 1V 1818MHz 0.58ns
XC7V585T-3FFG1761E Specification Parameters
- Part Status: Active
- Mounting Type: Surface Mount
- Surface Mount: YES
- Peak Reflow Temperature (Cel): NOT SPECIFIED
- Factory Lead Time: 10 Weeks
- Technology: CMOS
- Terminal Pitch: 1mm
- Terminal Position: BOTTOM
- Supply Voltage: 1V
- JESD-609 Code: e1
- Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
- Moisture Sensitivity Level (MSL): 4 (72 Hours)
- ECCN Code: 3A001.A.7.A
- Length: 42.5mm
- Operating Temperature: 0°C~100°C TJ
- Number of Outputs: 750
- Voltage - Supply: 0.97V~1.03V
- Clock Frequency: 1818MHz
- Pin Count: 1761
- Combinatorial Delay of a CLB-Max: 0.58 ns
- Total RAM Bits: 29306880
- Series: Virtex?-7 T
- Number of Logic Elements/Cells: 582720
- Base Part Number: XC7V585T
- RoHS Status: ROHS3 Compliant
- Pbfree Code: yes
- Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED
- Packaging: Tray
- Qualification Status: Not Qualified
- Published: 2010
- HTS Code: 8542.39.00.01
- Terminal Form: BALL
- Operating Supply Voltage: 1V
- Height Seated (Max): 3.5mm
- Subcategory: Field Programmable Gate Arrays
- Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Number of I/O: 850
- Width: 42.5mm
- Package / Case: 1760-BBGA, FCBGA
- Number of Inputs: 750
- Power Supplies: 11.8V
- Number of Terminations: 1761
- RAM Size: 3.5MB
- Speed Grade: -3
- JESD-30 Code: S-PBGA-B1761
- Number of LABs/CLBs: 45525
- Number of Registers: 728400
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Xilinx — Manufacturer Introduction
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.
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