XC7Z030-1FBG676IXilinx
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    • Manufacturer No：
      XC7Z030-1FBG676I
    • Manufacturer：
      Xilinx
    • Category：
      Embedded - System On Chip (SoC)
    • Datasheet：
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    • SKU：
      5170212
    • Description：
      BALL BOTTOM MCU FPGA Active System On Chip (SOC) IC -40C~100C TJ 256KB 667MHz 1V
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    Inventory:144
    • Qty Unit Price price
    • 1 $544165.139 $544165.139
    • 10 $538777.365 $5387773.65
    • 100 $533442.935 $53344293.5
    • 1000 $528161.321 $528161321
    • 10000 $522932 $5229320000

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    • Manufacturer No：
      XC7Z030-1FBG676I
    • Manufacturer：
      Xilinx
    • Category：
      Embedded - System On Chip (SoC)
    • Datasheet：
      XC7Z030-1FBG676I
    • SKU：
      5170212
    • Description：
      BALL BOTTOM MCU FPGA Active System On Chip (SOC) IC -40C~100C TJ 256KB 667MHz 1V

    User Guide

    User Guide

    XC7Z030-1FBG676I Details

    BALL BOTTOM MCU FPGA Active System On Chip (SOC) IC -40C~100C TJ 256KB 667MHz 1V

    XC7Z030-1FBG676I Specification Parameters

    • Part Status: Active
    • Radiation Hardening: No
    • Boundary Scan: YES
    • Factory Lead Time: 10 Weeks
    • Technology: CMOS
    • Published: 2009
    • HTS Code: 8542.39.00.01
    • Terminal Form: BALL
    • Operating Supply Voltage: 1V
    • Peak Reflow Temperature (Cel): 245
    • Moisture Sensitivity Level (MSL): 4 (72 Hours)
    • Core Architecture: ARM
    • Length: 27mm
    • Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
    • Architecture: MCU, FPGA
    • ECCN Code: 3A991.D
    • Number of Pins: 676
    • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
    • Package / Case: 676-BBGA, FCBGA
    • Series: Zynq?-7000
    • Interface: CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    • Bus Compatibility: CAN; ETHERNET; I2C; SPI; UART; USB
    • Base Part Number: XC7Z030
    • RoHS Status: ROHS3 Compliant
    • Surface Mount: YES
    • Packaging: Tray
    • Height Seated (Max): 2.54mm
    • Time@Peak Reflow Temperature-Max (s): 30
    • Terminal Pitch: 1mm
    • Terminal Position: BOTTOM
    • Supply Voltage: 1V
    • JESD-609 Code: e1
    • Contact Plating: Copper, Silver, Tin
    • Data Bus Width: 32b
    • Operating Temperature: -40°C~100°C TJ
    • Number of I/O: 130
    • RAM Size: 256kB
    • Supply Voltage-Max (Vsup): 1.05V
    • Number of Terminations: 676
    • Frequency: 667MHz
    • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    • Peripherals: DMA
    • Speed Grade: -1
    • RAM (words): 256000
    • Primary Attributes: Kintex?-7 FPGA, 125K Logic Cells
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    Xilinx — Manufacturer Introduction

    Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.

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