XC7Z030-2SB485IXilinx
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    XC7Z030-2SB485I123
    • Manufacturer No：
      XC7Z030-2SB485I
    • Manufacturer：
      Xilinx
    • Category：
      Embedded - System On Chip (SoC)
    • Datasheet：
      Get the PDF file
    • SKU：
      5165091
    • Description：
      MPU Zynq-7000 RISC 32-Bit 800MHz 1V 485-Pin FCBGA
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    • Qty Unit Price price
    • 1 $560.056 $560.056
    • 10 $554.51 $5545.1
    • 100 $549.019 $54901.9
    • 1000 $543.583 $543583
    • 10000 $538.2 $5382000

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    XC7Z030-2SB485I
    • Manufacturer No：
      XC7Z030-2SB485I
    • Manufacturer：
      Xilinx
    • Category：
      Embedded - System On Chip (SoC)
    • Datasheet：
      XC7Z030-2SB485I
    • SKU：
      5165091
    • Description：
      MPU Zynq-7000 RISC 32-Bit 800MHz 1V 485-Pin FCBGA

    User Guide

    User Guide

    XC7Z030-2SB485I Details

    MPU Zynq-7000 RISC 32-Bit 800MHz 1V 485-Pin FCBGA

    XC7Z030-2SB485I Specification Parameters

    • Part Status: Active
    • Packaging: Tray
    • Moisture Sensitivity Level (MSL): 3 (168 Hours)
    • Factory Lead Time: 11 Weeks
    • Data Bus Width: 32b
    • Operating Temperature: -40°C~100°C TJ
    • Frequency: 800MHz
    • Max Frequency: 800MHz
    • Architecture: MCU, FPGA
    • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
    • Peripherals: DMA
    • Interface: CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    • Primary Attributes: Kintex?-7 FPGA, 125K Logic Cells
    • RoHS Status: ROHS3 Compliant
    • Min Operating Temperature: -40°C
    • Published: 2009
    • Max Operating Temperature: 100°C
    • Core Architecture: ARM
    • Number of I/O: 130
    • Speed: 800MHz
    • RAM Size: 256kB
    • Memory Type: ROMless
    • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    • Series: Zynq?-7000
    • Number of Pins: 485
    • Package / Case: 484-FBGA, FCBGA
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    Xilinx — Manufacturer Introduction

    Xilinx
    Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.

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