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  • Manufacturer No:
    XC7Z035-L2FBG676I
  • Manufacturer:
  • Category:
    Embedded - System On Chip (SoC)
  • Datasheet:
    Get the PDF file
  • SKU:
    5166404
  • Description:
    BALL BOTTOM MCU FPGA Active System On Chip (SOC) IC -40C~100C TJ 256KB 800MHz 1V
  • Quantity:
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  • Qty Unit Price price
  • 1 $1604.749 $1604.749
  • 10 $1588.86 $15888.6
  • 100 $1573.128 $157312.8
  • 1000 $1557.552 $1557552

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  • Manufacturer No:
    XC7Z035-L2FBG676I
  • Manufacturer:
    Xilinx
  • Category:
    Embedded - System On Chip (SoC)
  • Datasheet:
    XC7Z035-L2FBG676I
  • SKU:
    5166404
  • Description:
    BALL BOTTOM MCU FPGA Active System On Chip (SOC) IC -40C~100C TJ 256KB 800MHz 1V

XC7Z035-L2FBG676I Details

BALL BOTTOM MCU FPGA Active System On Chip (SOC) IC -40C~100C TJ 256KB 800MHz 1V

XC7Z035-L2FBG676I Specification Parameters

  • Part Status: Active
  • Surface Mount: YES
  • Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED
  • Packaging: Tray
  • Height Seated (Max): 2.54mm
  • Moisture Sensitivity Level (MSL): 3 (168 Hours)
  • Terminal Pitch: 1mm
  • Terminal Position: BOTTOM
  • Supply Voltage: 1V
  • Core Architecture: ARM
  • Length: 27mm
  • Number of I/O: 130
  • Frequency: 800MHz
  • Supply Voltage-Min (Vsup): 0.95V
  • Supply Voltage-Max (Vsup): 1.05V
  • Number of Terminations: 676
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • JESD-30 Code: S-PBGA-B676
  • Series: Zynq?-7000
  • RAM (words): 256000
  • Additional Feature: PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
  • RoHS Status: ROHS3 Compliant
  • Boundary Scan: YES
  • Peak Reflow Temperature (Cel): NOT SPECIFIED
  • Factory Lead Time: 10 Weeks
  • Technology: CMOS
  • Published: 2010
  • HTS Code: 8542.39.00.01
  • Terminal Form: BALL
  • JESD-609 Code: e1
  • Operating Temperature: -40°C~100°C TJ
  • Width: 27mm
  • Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
  • RAM Size: 256kB
  • Architecture: MCU, FPGA
  • ECCN Code: 3A991.D
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Package / Case: 676-BBGA, FCBGA
  • Peripherals: DMA
  • Interface: CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
  • Bus Compatibility: CAN; ETHERNET; I2C; SPI; UART; USB
  • Primary Attributes: Kintex?-7 FPGA, 275K Logic Cells

Xilinx — Manufacturer Introduction

Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.

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