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- Manufacturer No：XC7Z045-3FBG676E
- Manufacturer：Xilinx
- Category：Embedded - System On Chip (SoC)
- Datasheet：XC7Z045-3FBG676E
- SKU：5175053
- Description：BALL ROMless BOTTOM MCU FPGA System On Chip (SOC) IC 0C~100C TJ 256KB 1GHz 1V
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User Guide
XC7Z045-3FBG676E Details
BALL ROMless BOTTOM MCU FPGA System On Chip (SOC) IC 0C~100C TJ 256KB 1GHz 1V
XC7Z045-3FBG676E Specification Parameters
- Part Status: Active
- Radiation Hardening: No
- Boundary Scan: YES
- Factory Lead Time: 10 Weeks
- Technology: CMOS
- Time@Peak Reflow Temperature-Max (s): 30
- Terminal Pitch: 1mm
- Terminal Position: BOTTOM
- Supply Voltage: 1V
- JESD-609 Code: e1
- Contact Plating: Copper, Silver, Tin
- Core Architecture: ARM
- Number of I/O: 130
- RAM Size: 256kB
- Architecture: MCU, FPGA
- Supply Voltage-Max (Vsup): 1.05V
- Operating Temperature: 0°C~100°C TJ
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Package / Case: 676-BBGA, FCBGA
- Peripherals: DMA
- Interface: CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Bus Compatibility: CAN; ETHERNET; I2C; SPI; UART; USB
- Primary Attributes: Kintex?-7 FPGA, 350K Logic Cells
- RoHS Status: ROHS3 Compliant
- Surface Mount: YES
- Packaging: Tray
- Height Seated (Max): 2.54mm
- Moisture Sensitivity Level (MSL): 3 (168 Hours)
- Published: 2009
- HTS Code: 8542.39.00.01
- Terminal Form: BALL
- Operating Supply Voltage: 1V
- Peak Reflow Temperature (Cel): 245
- Data Bus Width: 32b
- Length: 27mm
- Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Frequency: 1GHz
- Memory Type: ROMless
- ECCN Code: 3A991.D
- Number of Terminations: 676
- Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- JESD-30 Code: S-PBGA-B676
- Series: Zynq?-7000
- RAM (words): 256000
- Speed Grade: -3
- Base Part Number: XC7Z045
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Xilinx — Manufacturer Introduction
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.
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