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XCKU115-3FLVB1760E123
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XCKU115-3FLVB1760E
  • Manufacturer No:
    XCKU115-3FLVB1760E
  • Manufacturer:
    Xilinx
  • Category:
    Embedded - FPGAs (Field Programmable Gate Array)
  • Datasheet:
    XCKU115-3FLVB1760E
  • SKU:
    5164197
  • Description:
    CMOS 2012 ROHS3Compliant BALL field programmable gate array 0C~100C TJ 1V 3.71mm

XCKU115-3FLVB1760E Details

CMOS 2012 ROHS3Compliant BALL field programmable gate array 0C~100C TJ 1V 3.71mm

XCKU115-3FLVB1760E Specification Parameters

  • Part Status: Active
  • Packaging: Bulk
  • Surface Mount: YES
  • Peak Reflow Temperature (Cel): NOT SPECIFIED
  • Factory Lead Time: 10 Weeks
  • Technology: CMOS
  • Terminal Pitch: 1mm
  • Terminal Position: BOTTOM
  • Supply Voltage: 1V
  • JESD-609 Code: e1
  • Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
  • Moisture Sensitivity Level (MSL): 4 (72 Hours)
  • Width: 42.5mm
  • Package / Case: 1760-BBGA, FCBGA
  • Number of Outputs: 702
  • ECCN Code: 3A001.A.7.B
  • Height Seated (Max): 3.71mm
  • Number of CLBs: 5520
  • Voltage - Supply: 0.970V~1.030V
  • Total RAM Bits: 77721600
  • RoHS Status: ROHS3 Compliant
  • Mounting Type: Surface Mount
  • Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED
  • Packing Method: Tray
  • Qualification Status: Not Qualified
  • Published: 2012
  • HTS Code: 8542.39.00.01
  • Terminal Form: BALL
  • Power Supplies: 1V
  • Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
  • Subcategory: Field Programmable Gate Arrays
  • Length: 42.5mm
  • Operating Temperature: 0°C~100°C TJ
  • Number of I/O: 702
  • Number of Inputs: 702
  • JESD-30 Code: S-PBGA-B1760
  • Series: Kintex? UltraScale?
  • Number of LABs/CLBs: 82920
  • Number of Logic Elements/Cells: 1451100
  • Organization: 5520 CLBS

Xilinx — Manufacturer Introduction

Xilinx
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.

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