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  • Manufacturer No:
    XCKU3P-2FFVA676E
  • Manufacturer:
  • Category:
    Embedded - FPGAs (Field Programmable Gate Array)
  • Datasheet:
    Get the PDF file
  • SKU:
    5170944
  • Description:
    ROHS3Compliant Active e1 FIELD PROGRAMMABLE GATE ARRAY field programmable gate array 0C~100C TJ 0.825V~0.876V
  • Quantity:
      • RFQ
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  • Material flow:
  • Payment:
Inventory:0
  • Qty Unit Price price
  • 1 $2116.33 $2116.33
  • 10 $2095.376 $20953.76
  • 100 $2074.629 $207462.9
  • 1000 $2054.088 $2054088
  • 10000 $2033.75 $20337500

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  • Manufacturer No:
    XCKU3P-2FFVA676E
  • Manufacturer:
    Xilinx
  • Category:
    Embedded - FPGAs (Field Programmable Gate Array)
  • Datasheet:
    XCKU3P-2FFVA676E
  • SKU:
    5170944
  • Description:
    ROHS3Compliant Active e1 FIELD PROGRAMMABLE GATE ARRAY field programmable gate array 0C~100C TJ 0.825V~0.876V

XCKU3P-2FFVA676E Details

ROHS3Compliant Active e1 FIELD PROGRAMMABLE GATE ARRAY field programmable gate array 0C~100C TJ 0.825V~0.876V

XCKU3P-2FFVA676E Specification Parameters

  • Part Status: Active
  • Mounting Type: Surface Mount
  • Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED
  • Packaging: Tray
  • HTS Code: 8542.39.00.01
  • Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
  • Number of I/O: 256
  • Operating Temperature: 0°C~100°C TJ
  • Voltage - Supply: 0.825V~0.876V
  • Number of LABs/CLBs: 20340
  • Number of Logic Elements/Cells: 355950
  • RoHS Status: ROHS3 Compliant
  • Pbfree Code: yes
  • Peak Reflow Temperature (Cel): NOT SPECIFIED
  • Factory Lead Time: 11 Weeks
  • JESD-609 Code: e1
  • Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
  • Moisture Sensitivity Level (MSL): 4 (72 Hours)
  • Package / Case: 676-BBGA, FCBGA
  • Series: Kintex? UltraScale+?
  • Total RAM Bits: 31641600

Xilinx — Manufacturer Introduction

Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.

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