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- Manufacturer No：XCR3256XL-7PQG208C
- Manufacturer：Xilinx
- Category：Embedded - CPLDs (Complex Programmable Logic Devices)
- Datasheet：XCR3256XL-7PQG208C
- SKU：5164091
- Description：YES 208-BFQFP 2003 CoolRunner XPLA3 complex programmable logic device 154MHz 28mm 7.5ns 3V~3.6V
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XCR3256XL-7PQG208C Details
YES 208-BFQFP 2003 CoolRunner XPLA3 complex programmable logic device 154MHz 28mm 7.5ns 3V~3.6V
XCR3256XL-7PQG208C Specification Parameters
- Part Status: Active
- Mounting Type: Surface Mount
- ECCN Code: EAR99
- JTAG BST: YES
- JESD-609 Code: e3
- Supply Voltage: 3.3V
- Packaging: Tray
- Qualification Status: Not Qualified
- Terminal Form: GULL WING
- Moisture Sensitivity Level (MSL): 3 (168 Hours)
- Min Supply Voltage: 3V
- Speed Grade: 7
- HTS Code: 8542.39.00.01
- Published: 2003
- Voltage Supply - Internal: 3V~3.6V
- Number of Macro Cells: 256
- Length: 28mm
- Delay Time tpd(1) Max: 7ns
- Number of Pins: 208
- Output Function: MACROCELL
- Subcategory: Programmable Logic Devices
- Turn On Delay Time: 7.5 ns
- Number of Gates: 6000
- Programmable Type: In System Programmable (min 1K program/erase cycles)
- Max Frequency: 154MHz
- RoHS Status: ROHS3 Compliant
- Mount: Surface Mount
- Pbfree Code: yes
- Additional Feature: YES
- Contact Plating: Tin
- Operating Supply Voltage: 3.3V
- Factory Lead Time: 10 Weeks
- Number of Logic Elements/Cells: 16
- Technology: CMOS
- Time@Peak Reflow Temperature-Max (s): 30
- Terminal Pitch: 0.5mm
- Terminal Position: QUAD
- Max Supply Voltage: 3.6V
- Operating Temperature: 0°C~70°C TA
- Peak Reflow Temperature (Cel): 245
- Memory Type: EEPROM
- Width: 28mm
- Number of Terminations: 208
- Pin Count: 208
- Height Seated (Max): 4.1mm
- Propagation Delay: 7.5 ns
- Package / Case: 208-BFQFP
- Number of I/O: 164
- Series: CoolRunner XPLA3
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Xilinx — Manufacturer Introduction
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.
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