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  • Manufacturer No:
    XCS10XL-4VQG100I
  • Manufacturer:
    Xilinx
  • Category:
    Embedded - FPGAs (Field Programmable Gate Array)
  • Datasheet:
    XCS10XL-4VQG100I
  • SKU:
    5173124
  • Description:
    Spartan®-XL XCS10XL 100-TQFP Matte Tin (Sn) field programmable gate array 1mm 3.3V 217MHz 1.1ns

XCS10XL-4VQG100I Details

Spartan®-XL XCS10XL 100-TQFP Matte Tin (Sn) field programmable gate array 1mm 3.3V 217MHz 1.1ns

XCS10XL-4VQG100I Specification Parameters

  • Mounting Type: Surface Mount
  • RoHS Status: RoHS Compliant
  • Radiation Hardening: No
  • Part Status: Obsolete
  • Supply Voltage: 3.3V
  • Packaging: Tray
  • Technology: CMOS
  • Terminal Finish: Matte Tin (Sn)
  • Moisture Sensitivity Level (MSL): 3 (168 Hours)
  • Terminal Pitch: 0.5mm
  • Height: 1mm
  • Number of Pins: 100
  • Length: 14mm
  • Voltage - Supply: 3V~3.6V
  • Subcategory: Field Programmable Gate Arrays
  • Package / Case: 100-TQFP
  • Number of Equivalent Gates: 3000
  • Number of Outputs: 77
  • Number of CLBs: 196
  • Number of Registers: 616
  • Clock Frequency: 217MHz
  • Number of Logic Cells: 466
  • Series: Spartan?-XL
  • Mount: Surface Mount
  • ECCN Code: EAR99
  • JESD-609 Code: e3
  • Speed Grade: 4
  • Operating Supply Voltage: 3.3V
  • Terminal Form: GULL WING
  • Peak Reflow Temperature (Cel): 260
  • Published: 2011
  • Time@Peak Reflow Temperature-Max (s): 30
  • Terminal Position: QUAD
  • Number of Terminations: 100
  • Pin Count: 100
  • Width: 14mm
  • Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
  • Operating Temperature: -40°C~100°C TJ
  • Number of Gates: 10000
  • Number of I/O: 77
  • Number of LABs/CLBs: 196
  • Combinatorial Delay of a CLB-Max: 1.1 ns
  • Total RAM Bits: 6272
  • Number of Logic Elements/Cells: 466
  • RAM Size: 784B
  • Base Part Number: XCS10XL

Xilinx — Manufacturer Introduction

Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.

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