XCV3200E-6CG1156CXilinx
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    • Manufacturer No：
      XCV3200E-6CG1156C
    • Manufacturer：
      Xilinx
    • Category：
      Embedded - FPGAs (Field Programmable Gate Array)
    • Datasheet：
      XCV3200E-6CG1156C
    • SKU：
      5166879
    • Description：
      Contains Lead CMOS 2004 Non-RoHS Compliant field programmable gate array 0C~85C TJ 104kB 0.47ns 357.2MHz

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    User Guide

    XCV3200E-6CG1156C Details

    Contains Lead CMOS 2004 Non-RoHS Compliant field programmable gate array 0C~85C TJ 104kB 0.47ns 357.2MHz

    XCV3200E-6CG1156C Specification Parameters

    • Mounting Type: Surface Mount
    • Radiation Hardening: No
    • Part Status: Obsolete
    • Pbfree Code: no
    • Speed Grade: 6
    • Technology: CMOS
    • Supply Voltage: 1.8V
    • Terminal Pitch: 1mm
    • Terminal Position: BOTTOM
    • Terminal Form: BALL
    • Length: 35mm
    • Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
    • Operating Temperature: 0°C~85°C TJ
    • Voltage - Supply: 1.71V~1.89V
    • Number of I/O: 804
    • Series: Virtex?-E
    • Height Seated (Max): 3.11mm
    • RAM Size: 104kB
    • Number of LABs/CLBs: 16224
    • Number of Logic Elements/Cells: 73008
    • Mount: Surface Mount
    • RoHS Status: Non-RoHS Compliant
    • Packaging: Tray
    • Lead Free: Contains Lead
    • JESD-609 Code: e0
    • Moisture Sensitivity Level (MSL): 3 (168 Hours)
    • Operating Supply Voltage: 1.8V
    • HTS Code: 8542.39.00.01
    • Published: 2004
    • Terminal Finish: TIN LEAD
    • Width: 35mm
    • Subcategory: Field Programmable Gate Arrays
    • ECCN Code: 3A001.A.7.A
    • Number of Pins: 1156
    • Number of Outputs: 804
    • Combinatorial Delay of a CLB-Max: 0.47 ns
    • Total RAM Bits: 851968
    • Package / Case: 1156-BCBGA
    • Number of Gates: 4074387
    • Base Part Number: XCV3200E
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    Xilinx — Manufacturer Introduction

    Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.

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