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  • Manufacturer No:
    XCV50-5BG256C
  • Manufacturer:
    Xilinx
  • Category:
    Embedded - FPGAs (Field Programmable Gate Array)
  • Datasheet:
    XCV50-5BG256C
  • SKU:
    5164065
  • Description:
    Contains Lead CMOS 2000 Non-RoHS Compliant FPGA 0C~85C TJ 4kB 0.7ns 294MHz

XCV50-5BG256C Details

Contains Lead CMOS 2000 Non-RoHS Compliant FPGA 0C~85C TJ 4kB 0.7ns 294MHz

XCV50-5BG256C Specification Parameters

  • Mounting Type: Surface Mount
  • ECCN Code: EAR99
  • Part Status: Obsolete
  • Pbfree Code: no
  • Qualification Status: Not Qualified
  • Technology: CMOS
  • Moisture Sensitivity Level (MSL): 3 (168 Hours)
  • Reach Compliance Code: not_compliant
  • HTS Code: 8542.39.00.01
  • Terminal Form: BALL
  • Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
  • Number of Terminations: 256
  • Pin Count: 256
  • Terminal Finish: Tin/Lead (Sn63Pb37)
  • Operating Temperature: 0°C~85°C TJ
  • Width: 27mm
  • Number of Outputs: 180
  • Total RAM Bits: 32768
  • Number of LABs/CLBs: 384
  • Combinatorial Delay of a CLB-Max: 0.7 ns
  • Number of Logic Elements/Cells: 1728
  • Power Supplies: 1.2/3.62.5V
  • Number of Gates: 57906
  • Mount: Surface Mount
  • RoHS Status: Non-RoHS Compliant
  • Packaging: Tray
  • Lead Free: Contains Lead
  • JESD-609 Code: e0
  • Supply Voltage: 2.5V
  • Time@Peak Reflow Temperature-Max (s): 30
  • Terminal Pitch: 1.27mm
  • Terminal Position: BOTTOM
  • Published: 2000
  • Subcategory: Field Programmable Gate Arrays
  • Number of Pins: 256
  • Peak Reflow Temperature (Cel): 225
  • Voltage - Supply: 2.375V~2.625V
  • Length: 27mm
  • Number of I/O: 180
  • RAM Size: 4kB
  • Number of CLBs: 384
  • Height Seated (Max): 2.55mm
  • Package / Case: 256-BBGA
  • Series: Virtex?
  • Clock Frequency: 294MHz
  • Base Part Number: XCV50

Xilinx — Manufacturer Introduction

Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.

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