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- Manufacturer No：XCVU190-2FLGA2577I
- Manufacturer：Xilinx
- Category：Embedded - FPGAs (Field Programmable Gate Array)
- Datasheet：XCVU190-2FLGA2577I
- SKU：5164623
- Description：ROHS3Compliant BALL Active BOTTOM FPGA -40C~100C TJ 0.95V 4.01mm
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XCVU190-2FLGA2577I Details
ROHS3Compliant BALL Active BOTTOM FPGA -40C~100C TJ 0.95V 4.01mm
XCVU190-2FLGA2577I Specification Parameters
- Part Status: Active
- Mounting Type: Surface Mount
- Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED
- Factory Lead Time: 12 Weeks
- Reach Compliance Code: not_compliant
- HTS Code: 8542.39.00.01
- Terminal Form: BALL
- Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
- Moisture Sensitivity Level (MSL): 4 (72 Hours)
- Operating Temperature: -40°C~100°C TJ
- Height Seated (Max): 4.01mm
- Width: 52.5mm
- ECCN Code: 3A001.A.7.B
- Series: Virtex? UltraScale?
- Number of LABs/CLBs: 134280
- Number of Logic Elements/Cells: 2349900
- JESD-30 Code: S-PBGA-B2577
- RoHS Status: ROHS3 Compliant
- Surface Mount: YES
- Peak Reflow Temperature (Cel): NOT SPECIFIED
- Packaging: Tray
- Terminal Pitch: 1mm
- Terminal Position: BOTTOM
- JESD-609 Code: e1
- Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
- Number of CLBs: 1800
- Supply Voltage: 0.95V
- Length: 52.5mm
- Number of I/O: 448
- Voltage - Supply: 0.922V~0.979V
- Package / Case: 2577-BBGA, FCBGA
- Total RAM Bits: 150937600
- Organization: 1800 CLBS
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Xilinx — Manufacturer Introduction
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.
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