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XCVU190-3FLGA2577E123
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XCVU190-3FLGA2577E
  • Manufacturer No:
    XCVU190-3FLGA2577E
  • Manufacturer:
    Xilinx
  • Category:
    Embedded - FPGAs (Field Programmable Gate Array)
  • Datasheet:
    XCVU190-3FLGA2577E
  • SKU:
    5176857
  • Description:
    ROHS3Compliant BALL Active BOTTOM field programmable gate array 0C~100C TJ 1V 4.01mm

XCVU190-3FLGA2577E Details

ROHS3Compliant BALL Active BOTTOM field programmable gate array 0C~100C TJ 1V 4.01mm

XCVU190-3FLGA2577E Specification Parameters

  • Part Status: Active
  • Mounting Type: Surface Mount
  • Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED
  • Packaging: Tray
  • Reach Compliance Code: not_compliant
  • HTS Code: 8542.39.00.01
  • Terminal Form: BALL
  • JESD-609 Code: e1
  • Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
  • Number of CLBs: 1800
  • Height Seated (Max): 4.01mm
  • Width: 52.5mm
  • ECCN Code: 3A001.A.7.B
  • Voltage - Supply: 0.970V~1.030V
  • Number of LABs/CLBs: 134280
  • Number of Logic Elements/Cells: 2349900
  • JESD-30 Code: S-PBGA-B2577
  • RoHS Status: ROHS3 Compliant
  • Surface Mount: YES
  • Peak Reflow Temperature (Cel): NOT SPECIFIED
  • Factory Lead Time: 10 Weeks
  • Terminal Pitch: 1mm
  • Terminal Position: BOTTOM
  • Supply Voltage: 1V
  • Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
  • Moisture Sensitivity Level (MSL): 4 (72 Hours)
  • Operating Temperature: 0°C~100°C TJ
  • Length: 52.5mm
  • Number of I/O: 448
  • Series: Virtex? UltraScale?
  • Package / Case: 2577-BBGA, FCBGA
  • Total RAM Bits: 150937600
  • Organization: 1800 CLBS

Xilinx — Manufacturer Introduction

Xilinx
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.

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