XCZU11EG-3FFVC1156EXilinx
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    XCZU11EG-3FFVC1156E
    • Manufacturer No：
      XCZU11EG-3FFVC1156E
    • Manufacturer：
      Xilinx
    • Category：
      Embedded - System On Chip (SoC)
    • Datasheet：
      XCZU11EG-3FFVC1156E
    • SKU：
      5173360
    • Description：
      IC FPGA 360 I/O 1156FCBGA

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    User Guide

    XCZU11EG-3FFVC1156E Details

    IC FPGA 360 I/O 1156FCBGA

    XCZU11EG-3FFVC1156E Specification Parameters

    • Part Status: Active
    • Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED
    • Packaging: Tray
    • Factory Lead Time: 11 Weeks
    • Moisture Sensitivity Level (MSL): 4 (72 Hours)
    • Architecture: MCU, FPGA
    • Operating Temperature: 0°C~100°C TJ
    • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2
    • Primary Attributes: Zynq?UltraScale+? FPGA, 653K+ Logic Cells
    • RoHS Status: ROHS3 Compliant
    • Peak Reflow Temperature (Cel): NOT SPECIFIED
    • Published: 2016
    • HTS Code: 8542.31.00.01
    • RAM Size: 256kB
    • Number of I/O: 360
    • Peripherals: DMA, WDT
    • Package / Case: 1156-BBGA, FCBGA
    • Series: Zynq? UltraScale+? MPSoC EG
    • Speed: 600MHz, 667MHz, 1.5GHz
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    Xilinx — Manufacturer Introduction

    Xilinx
    Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.

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