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MC68HC705C9AVFNE123
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MC68HC705C9AVFNE
  • Manufacturer No:
    MC68HC705C9AVFNE
  • Manufacturer:
    Freescale Semiconductor, Inc. (NXP Semiconductors)
  • Category:
    Embedded - Microcontrollers
  • Datasheet:
    MC68HC705C9AVFNE
  • SKU:
    10930064
  • Description:
    Lead Free RoHS Compliant J BEND QUAD Microcontroller 2.1mus 105C 2.1MHz 4.57mm

MC68HC705C9AVFNE Details

Lead Free RoHS Compliant J BEND QUAD Microcontroller 2.1mus 105C 2.1MHz 4.57mm

MC68HC705C9AVFNE Specification Parameters

  • DMA Channels: NO
  • Has ADC: NO
  • Number of Timers/Counters: 1
  • ECCN Code: EAR99
  • Surface Mount: YES
  • Lead Free: Lead Free
  • Supply Voltage: 5V
  • Min Operating Temperature: -40°C
  • Time@Peak Reflow Temperature-Max (s): 30
  • Max Supply Voltage: 5.5V
  • Max Operating Temperature: 105°C
  • Temperature Grade: INDUSTRIAL
  • Number of Pins: 44
  • Oscillator Type: Internal
  • Height Seated (Max): 4.57mm
  • Number of Programmable I/O: 31
  • uPs/uCs/Peripheral ICs Type: MICROCONTROLLER
  • Peak Reflow Temperature (Cel): 220
  • Package / Case: PLCC
  • Frequency: 2.1MHz
  • Memory Type: EPROM, OTP
  • Access Time: 2.1 μs
  • RAM Size: 352B
  • DAC Channels: NO
  • PWM Channels: NO
  • RoHS Status: RoHS Compliant
  • Radiation Hardening: No
  • JESD-609 Code: e3
  • Bit Size: 8
  • Moisture Sensitivity Level (MSL): 3
  • Terminal Finish: Matte Tin (Sn)
  • Min Supply Voltage: 3V
  • Number of I/O: 24
  • Terminal Position: QUAD
  • Number of Terminations: 44
  • Pin Count: 44
  • Terminal Form: J BEND
  • Halogen Free: Halogen Free
  • Data Bus Width: 8b
  • Technology: HCMOS
  • Peripherals: POR, WDT
  • Interface: SCI, SPI
  • Frequency (Max): 2.1MHz
  • ROM Programmability: OTPROM
  • Memory Size: 15.6kB

Freescale Semiconductor, Inc. (NXP Semiconductors) — Manufacturer Introduction

Freescale Semiconductor, Inc. (NXP Semiconductors)
Freescale Semiconductor is now NXP Semiconductor. Freescale semiconductor was a global leader in embedded processing solutions. From microprocessors and microcontrollers to sensors, analog integrated circuits and connectivity – their technologies are the foundation for the innovations that make our world greener, safer, healthier and more connected. Some of their key applications and end-markets include automotive safety, hybrid and all-electric vehicles, next generation wireless infrastructure, smart energy management, portable medical devices, consumer appliances and smart mobile devices.

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