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  • Manufacturer No:
    MPC7410RX500LE
  • Manufacturer:
    Freescale Semiconductor, Inc. (NXP Semiconductors)
  • Category:
    Embedded - Microprocessors
  • Datasheet:
    MPC7410RX500LE
  • SKU:
    10930817
  • Description:
    FLOATING POINT MICROPROCESSOR RISC PowerPC BALL IC Microprocessor 500mus 105C 25mm 1.8V

MPC7410RX500LE Details

FLOATING POINT MICROPROCESSOR RISC PowerPC BALL IC Microprocessor 500mus 105C 25mm 1.8V

MPC7410RX500LE Specification Parameters

  • Packaging: Bulk
  • Number of Cores: 1
  • Surface Mount: YES
  • Boundary Scan: YES
  • Lead Free: Contains Lead
  • JESD-609 Code: e0
  • Time@Peak Reflow Temperature-Max (s): 30
  • Terminal Finish: Tin/Lead (Sn/Pb)
  • Bit Size: 32
  • Height Seated (Max): 3.2mm
  • External Data Bus Width: 64
  • Terminal Form: BALL
  • Length: 25mm
  • Peak Reflow Temperature (Cel): 245
  • uPs/uCs/Peripheral ICs Type: MICROPROCESSOR, RISC
  • Number of Terminations: 360
  • Number of Pins: 360
  • Access Time: 500 μs
  • Moisture Sensitivity Level (MSL): 1
  • RoHS Status: RoHS Compliant
  • Low Power Mode: YES
  • Integrated Cache: YES
  • Qualification Status: Not Qualified
  • Technology: CMOS
  • Supply Voltage: 1.8V
  • Max Operating Temperature: 105°C
  • Address Bus Width: 32
  • Terminal Position: BOTTOM
  • Min Operating Temperature: 0°C
  • Halogen Free: Halogen Free
  • Width: 25mm
  • Frequency: 500MHz
  • Subcategory: Microprocessors
  • Pin Count: 360
  • Format: FLOATING POINT
  • Core Architecture: PowerPC

Freescale Semiconductor, Inc. (NXP Semiconductors) — Manufacturer Introduction

Freescale Semiconductor is now NXP Semiconductor. Freescale semiconductor was a global leader in embedded processing solutions. From microprocessors and microcontrollers to sensors, analog integrated circuits and connectivity – their technologies are the foundation for the innovations that make our world greener, safer, healthier and more connected. Some of their key applications and end-markets include automotive safety, hybrid and all-electric vehicles, next generation wireless infrastructure, smart energy management, portable medical devices, consumer appliances and smart mobile devices.

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