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- Manufacturer No：DMS3017SSD-13
- Manufacturer：Diodes Incorporated
- Category：Transistors - FETs, MOSFETs - Arrays
- Datasheet：DMS3017SSD-13
- SKU：1746504
- Description：MOSFET Dual N-Ch DIOFET VDSS 30V VGSS 20V
User Guide
User Guide
DMS3017SSD-13 Details
MOSFET Dual N-Ch DIOFET VDSS 30V VGSS 20V
DMS3017SSD-13 Specification Parameters
- RoHS Status: ROHS3 Compliant
- Number of Elements: 2
- Mounting Type: Surface Mount
- Packaging: Tape & Reel (TR)
- Pbfree Code: yes
- JESD-609 Code: e3
- Number of Pins: 8
- Pin Count: 8
- REACH SVHC: No SVHC
- Threshold Voltage: 2.5V
- Time@Peak Reflow Temperature-Max (s): 40
- Published: 2010
- Factory Lead Time: 20 Weeks
- Gate to Source Voltage (Vgs): 20V
- Operating Temperature: -55°C~150°C TJ
- Continuous Drain Current (ID): 8A
- Operating Mode: ENHANCEMENT MODE
- Subcategory: FET General Purpose Power
- FET Feature: Logic Level Gate
- FET Type: 2 N-Channel (Dual)
- Weight: 73.992255mg
- Power Dissipation: 1.79W
- Current - Continuous Drain (Id) @ 25°C: 8A 6A
- Rds On (Max) @ Id, Vgs: 12m Ω @ 9.5A, 10V
- Moisture Sensitivity Level (MSL): 1 (Unlimited)
- Number of Channels: 2
- Mount: Surface Mount
- ECCN Code: EAR99
- Radiation Hardening: No
- Part Status: Obsolete
- Number of Terminations: 8
- Terminal Form: GULL WING
- Peak Reflow Temperature (Cel): 260
- Terminal Finish: Matte Tin (Sn)
- Element Configuration: Dual
- Transistor Element Material: SILICON
- Drain Current-Max (Abs) (ID): 10A
- Drain to Source Breakdown Voltage: 30V
- Package / Case: 8-SOIC (0.154, 3.90mm Width)
- Transistor Application: SWITCHING
- Additional Feature: HIGH RELIABILITY
- FET Technology: METAL-OXIDE SEMICONDUCTOR
- Vgs(th) (Max) @ Id: 2.5V @ 250μA
- Nominal Vgs: 2.5 V
- Max Power Dissipation: 1.19W
- Gate Charge (Qg) (Max) @ Vgs: 30.6nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds: 1276pF @ 15V
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Diodes Incorporated — Manufacturer Introduction
Diodes Incorporated delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. They leverage their expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Their broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 25 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets.
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