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- Manufacturer No：DMN4027SSD-13
- Manufacturer：Diodes Incorporated
- Category：Transistors - FETs, MOSFETs - Arrays
- Datasheet：DMN4027SSD-13
- SKU：1749960
- Description：MOSFET 2N-CH 40V 5.4A 8SO
User Guide
User Guide
DMN4027SSD-13 Details
MOSFET 2N-CH 40V 5.4A 8SO
DMN4027SSD-13 Specification Parameters
- Part Status: Active
- Moisture Sensitivity Level (MSL): 1 (Unlimited)
- Mounting Type: Surface Mount
- Packaging: Tape & Reel (TR)
- Pbfree Code: yes
- JESD-609 Code: e3
- Number of Pins: 8
- Pin Count: 8
- REACH SVHC: No SVHC
- Time@Peak Reflow Temperature-Max (s): 40
- Published: 2010
- Length: 5mm
- Gate to Source Voltage (Vgs): 20V
- Drain to Source Voltage (Vdss): 40V
- Operating Temperature: -55°C~150°C TJ
- Transistor Application: SWITCHING
- Height: 1.5mm
- FET Technology: METAL-OXIDE SEMICONDUCTOR
- Vgs(th) (Max) @ Id: 3V @ 250μA
- Max Power Dissipation: 1.8W
- Continuous Drain Current (ID): 5.4A
- Drain Current-Max (Abs) (ID): 7.1A
- Turn On Delay Time: 3.1 ns
- Weight: 73.992255mg
- Gate Charge (Qg) (Max) @ Vgs: 12.9nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds: 604pF @ 20V
- RoHS Status: ROHS3 Compliant
- Number of Elements: 2
- Mount: Surface Mount
- ECCN Code: EAR99
- Radiation Hardening: No
- Contact Plating: Tin
- Number of Terminations: 8
- Terminal Form: GULL WING
- Peak Reflow Temperature (Cel): 260
- Element Configuration: Dual
- Transistor Element Material: SILICON
- Factory Lead Time: 17 Weeks
- Width: 4mm
- Drain to Source Breakdown Voltage: 40V
- Package / Case: 8-SOIC (0.154, 3.90mm Width)
- Operating Mode: ENHANCEMENT MODE
- Additional Feature: HIGH RELIABILITY
- Fall Time (Typ): 7.5 ns
- FET Feature: Logic Level Gate
- FET Type: 2 N-Channel (Dual)
- Subcategory: FET General Purpose Powers
- Power Dissipation: 2.1W
- Rise Time: 3.1 ns
- Turn-Off Delay Time: 15.4 ns
- Rds On (Max) @ Id, Vgs: 27m Ω @ 7A, 10V
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Diodes Incorporated — Manufacturer Introduction
Diodes Incorporated delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. They leverage their expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Their broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 25 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets.
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