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- Manufacturer No：ZXMN3F31DN8TA
- Manufacturer：Diodes Incorporated
- Category：Transistors - FETs, MOSFETs - Arrays
- Datasheet：ZXMN3F31DN8TA
- SKU：1756285
- Description：Dual N-Channel 30 V 0.024 Ohm Surface Mount Enhancement Mode MOSFET - SOP-8
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User Guide
ZXMN3F31DN8TA Details
Dual N-Channel 30 V 0.024 Ohm Surface Mount Enhancement Mode MOSFET - SOP-8
ZXMN3F31DN8TA Specification Parameters
- Part Status: Active
- Moisture Sensitivity Level (MSL): 1 (Unlimited)
- Number of Channels: 2
- Mount: Surface Mount
- ECCN Code: EAR99
- Radiation Hardening: No
- Lead Free: Lead Free
- Number of Terminations: 8
- Terminal Form: GULL WING
- Peak Reflow Temperature (Cel): 260
- Time@Peak Reflow Temperature-Max (s): 40
- Published: 2008
- Length: 5mm
- Gate to Source Voltage (Vgs): 20V
- Width: 4mm
- Package / Case: 8-SOIC (0.154, 3.90mm Width)
- Operating Mode: ENHANCEMENT MODE
- Subcategory: FET General Purpose Power
- Fall Time (Typ): 8 ns
- FET Feature: Logic Level Gate
- Max Power Dissipation: 1.8W
- Resistance: 24mOhm
- Drain Current-Max (Abs) (ID): 5.7A
- Rise Time: 3.3 ns
- Weight: 73.992255mg
- Rds On (Max) @ Id, Vgs: 24m Ω @ 7A, 10V
- RoHS Status: ROHS3 Compliant
- Number of Elements: 2
- Mounting Type: Surface Mount
- Packaging: Tape & Reel (TR)
- Pbfree Code: yes
- JESD-609 Code: e3
- Number of Pins: 8
- Pin Count: 8
- REACH SVHC: No SVHC
- Terminal Finish: Matte Tin (Sn)
- Element Configuration: Dual
- Transistor Element Material: SILICON
- Factory Lead Time: 17 Weeks
- Drain to Source Breakdown Voltage: 30V
- Operating Temperature: -55°C~150°C TJ
- Transistor Application: SWITCHING
- Height: 1.5mm
- FET Technology: METAL-OXIDE SEMICONDUCTOR
- Vgs(th) (Max) @ Id: 3V @ 250μA
- Turn-Off Delay Time: 16 ns
- FET Type: 2 N-Channel (Dual)
- Continuous Drain Current (ID): 7.3A
- Current - Continuous Drain (Id) @ 25°C: 5.7A
- Turn On Delay Time: 2.9 ns
- Gate Charge (Qg) (Max) @ Vgs: 12.9nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds: 608pF @ 15V
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Diodes Incorporated — Manufacturer Introduction
Diodes Incorporated delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. They leverage their expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Their broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 25 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets.
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