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- Manufacturer No：DMN63D8LV-7
- Manufacturer：Diodes Incorporated
- Category：Transistors - FETs, MOSFETs - Arrays
- Datasheet：DMN63D8LV-7
- SKU：1793738
- Description：MOSFET 2N-CH 30V 0.26A SOT563
User Guide
User Guide
DMN63D8LV-7 Details
MOSFET 2N-CH 30V 0.26A SOT563
DMN63D8LV-7 Specification Parameters
- Part Status: Active
- Moisture Sensitivity Level (MSL): 1 (Unlimited)
- Mounting Type: Surface Mount
- ECCN Code: EAR99
- Lead Free: Lead Free
- Number of Pins: 6
- Factory Lead Time: 16 Weeks
- Terminal Finish: Matte Tin (Sn)
- Element Configuration: Dual
- Transistor Element Material: SILICON
- Drain to Source Voltage (Vdss): 30V
- Width: 1.25mm
- Height: 600μm
- Terminal Form: FLAT
- Threshold Voltage: 1.5V
- Additional Feature: HIGH RELIABILITY
- Length: 1.7mm
- Turn-Off Delay Time: 12 ns
- Max Power Dissipation: 450mW
- FET Feature: Logic Level Gate
- Reference Standard: AEC-Q101
- Package / Case: SOT-563, SOT-666
- Fall Time (Typ): 6.3 ns
- Rise Time: 3.2 ns
- Gate Charge (Qg) (Max) @ Vgs: 0.87nC @ 10V
- Base Part Number: DMN63D8L
- RoHS Status: ROHS3 Compliant
- Number of Elements: 2
- Mount: Surface Mount
- JESD-609 Code: e3
- Number of Terminations: 6
- REACH SVHC: No SVHC
- Peak Reflow Temperature (Cel): 260
- Time@Peak Reflow Temperature-Max (s): 30
- Published: 2007
- Gate to Source Voltage (Vgs): 20V
- Drain to Source Breakdown Voltage: 30V
- Operating Temperature: -55°C~150°C TJ
- Packaging: Cut Tape (CT)
- Transistor Application: SWITCHING
- Operating Mode: ENHANCEMENT MODE
- Subcategory: FET General Purpose Power
- FET Technology: METAL-OXIDE SEMICONDUCTOR
- Drain-source On Resistance-Max: 4.5Ohm
- Power Dissipation: 450mW
- Continuous Drain Current (ID): 260mA
- FET Type: 2 N-Channel (Dual)
- Vgs(th) (Max) @ Id: 1.5V @ 250μA
- Turn On Delay Time: 3.3 ns
- Input Capacitance (Ciss) (Max) @ Vds: 22pF @ 25V
- Rds On (Max) @ Id, Vgs: 2.8 Ω @ 250mA, 10V
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Diodes Incorporated — Manufacturer Introduction
Diodes Incorporated delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. They leverage their expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Their broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 25 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets.
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