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  • Manufacturer No:
    2514-6002UB
  • Manufacturer:
    3M
  • Category:
    Rectangular Connectors - Headers, Male Pins
  • Datasheet:
    2514-6002UB
  • SKU:
    2244869
  • Description:
    CONN HEADER VERT 14POS 2.54MM

2514-6002UB Details

CONN HEADER VERT 14POS 2.54MM

2514-6002UB Specification Parameters

  • Moisture Sensitivity Level (MSL): 1 (Unlimited)
  • Mounting Type: Through Hole
  • RoHS Status: Non-RoHS Compliant
  • Contact Plating: Gold
  • Termination: Solder
  • Flammability Rating: UL94 V-0
  • Gender: Male
  • Fastening Type: Push-Pull
  • Contact Shape: Square
  • Lead Free: Contains Lead
  • Lead Pitch: 2.54mm
  • Contact Material: Copper Alloy
  • Contact Finish Thickness - Mating: 30.0μin 0.76μm
  • Connector Type: Header
  • Orientation: Straight
  • Number of Contacts: 14
  • Operating Temperature: -55°C~105°C
  • Shrouding: Shrouded - 4 Wall
  • Voltage - Rated: 1kV
  • Contact Finish - Post: Tin-Lead
  • Color: Grey
  • Feature: Keying Slot
  • Current Rating: 1.75A
  • Contact Length - Post: 0.112 2.84mm
  • Contact Length - Mating: 0.243 6.17mm
  • Number of Rows: 2
  • Mount: Through Hole
  • Contact Finish - Mating: Gold
  • Insulation Color: Black
  • Material Flammability Rating: UL94 V-0
  • Pitch - Mating: 0.100 2.54mm
  • Number of Positions Loaded: All
  • Factory Lead Time: 6 Weeks
  • Packaging: Tray
  • Contact Type: Male Pin
  • Pitch: 2.54mm
  • Style: Board to Board or Cable
  • Row Spacing - Mating: 0.100 (2.54mm)
  • Approval Agency: UL
  • Number of Positions: 14
  • Published: 2005
  • Housing Material: Plastic
  • Part Status: Last Time Buy
  • Contact Finish Thickness - Post: 200.0μin 5.08μm
  • Insulation Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Housing Color: Grey
  • Current Rating (Amps): 1.75A
  • Insulation Height: 0.390 9.91mm
  • Series: 2500

3M — Manufacturer Introduction

3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M? Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak? High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX? and SLA modeling - 3M's experienced engineers turn ideas into real world solutions. 3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool? Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.

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