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- Manufacturer No：XCV1000-6BG560C
- Manufacturer：Xilinx
- Category：Embedded - FPGAs (Field Programmable Gate Array)
- Datasheet：XCV1000-6BG560C
- SKU：5170653
- Description：Virtex® XCV1000 560-LBGA Exposed Pad Metal Tin/Lead (Sn63Pb37) field programmable gate array 1.7mm 1.2/3.62.5V 333MHz 0.6ns
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User Guide
XCV1000-6BG560C Details
Virtex® XCV1000 560-LBGA Exposed Pad Metal Tin/Lead (Sn63Pb37) field programmable gate array 1.7mm 1.2/3.62.5V 333MHz 0.6ns
XCV1000-6BG560C Specification Parameters
- Mounting Type: Surface Mount
- ECCN Code: EAR99
- Part Status: Obsolete
- Lead Free: Contains Lead
- JESD-609 Code: e0
- Supply Voltage: 2.5V
- Time@Peak Reflow Temperature-Max (s): 30
- Terminal Pitch: 1.27mm
- Terminal Position: BOTTOM
- Published: 2000
- Subcategory: Field Programmable Gate Arrays
- Terminal Finish: Tin/Lead (Sn63Pb37)
- Height Seated (Max): 1.7mm
- RAM Size: 16kB
- Length: 42.5mm
- Clock Frequency: 333MHz
- Number of I/O: 404
- Number of LABs/CLBs: 6144
- Number of Terminations: 560
- Series: Virtex?
- Number of Logic Elements/Cells: 27648
- JESD-30 Code: S-PBGA-B560
- Base Part Number: XCV1000
- Mount: Surface Mount
- RoHS Status: Non-RoHS Compliant
- Packaging: Tray
- Qualification Status: Not Qualified
- Technology: CMOS
- Moisture Sensitivity Level (MSL): 3 (168 Hours)
- Reach Compliance Code: not_compliant
- HTS Code: 8542.39.00.01
- Terminal Form: BALL
- Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
- Peak Reflow Temperature (Cel): 225
- Voltage - Supply: 2.375V~2.625V
- Operating Temperature: 0°C~85°C TJ
- Total RAM Bits: 131072
- Width: 42.5mm
- Number of Outputs: 404
- Number of Inputs: 404
- Combinatorial Delay of a CLB-Max: 0.6 ns
- Pin Count: 560
- Power Supplies: 1.2/3.62.5V
- Package / Case: 560-LBGA Exposed Pad, Metal
- Number of Gates: 1124022
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Xilinx — Manufacturer Introduction
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.
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