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- Manufacturer No：XC2V2000-4FGG676I
- Manufacturer：Xilinx
- Category：Embedded - FPGAs (Field Programmable Gate Array)
- Datasheet：XC2V2000-4FGG676I
- SKU：5171386
- Description：Virtex®-II XC2V2000 676-BGA Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) field programmable gate array 2.6mm 1.51.5/3.33.3V 650MHz 0.44ns
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User Guide
XC2V2000-4FGG676I Details
Virtex®-II XC2V2000 676-BGA Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) field programmable gate array 2.6mm 1.51.5/3.33.3V 650MHz 0.44ns
XC2V2000-4FGG676I Specification Parameters
- Mounting Type: Surface Mount
- Pbfree Code: yes
- Part Status: Obsolete
- Qualification Status: Not Qualified
- Moisture Sensitivity Level (MSL): 3 (168 Hours)
- Terminal Pitch: 1mm
- Published: 2001
- Terminal Form: BALL
- Supply Voltage: 1.5V
- Subcategory: Field Programmable Gate Arrays
- Operating Temperature: -40°C~100°C TJ
- Width: 27mm
- Voltage - Supply: 1.425V~1.575V
- Number of Terminations: 676
- Clock Frequency: 650MHz
- Number of Outputs: 456
- Number of Inputs: 456
- JESD-30 Code: S-PBGA-B676
- Number of Gates: 2000000
- Combinatorial Delay of a CLB-Max: 0.44 ns
- Total RAM Bits: 1032192
- Base Part Number: XC2V2000
- RoHS Status: RoHS Compliant
- Surface Mount: YES
- Packaging: Tray
- Technology: CMOS
- Time@Peak Reflow Temperature-Max (s): 30
- HTS Code: 8542.39.00.01
- Terminal Position: BOTTOM
- JESD-609 Code: e1
- Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
- Height Seated (Max): 2.6mm
- Length: 27mm
- Peak Reflow Temperature (Cel): 250
- ECCN Code: 3A991.D
- Pin Count: 676
- Terminal Finish: Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
- Number of I/O: 456
- Package / Case: 676-BGA
- Series: Virtex?-II
- Power Supplies: 1.51.5/3.33.3V
- Number of LABs/CLBs: 2688
- Number of Logic Cells: 24192
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Xilinx — Manufacturer Introduction
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.
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