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A2F060M3E-FGG256
  • Manufacturer No:
    A2F060M3E-FGG256
  • Manufacturer:
    Microsemi Corporation
  • Category:
    Embedded - System On Chip (SoC)
  • Datasheet:
    A2F060M3E-FGG256
  • SKU:
    3927511
  • Description:
    IC FPGA 60K GATES 128KB 256FBGA

A2F060M3E-FGG256 Details

IC FPGA 60K GATES 128KB 256FBGA

A2F060M3E-FGG256 Specification Parameters

  • Mount: Surface Mount
  • Part Status: Obsolete
  • Technology: CMOS
  • Moisture Sensitivity Level (MSL): 3 (168 Hours)
  • Factory Lead Time: 2 Weeks
  • HTS Code: 8542.39.00.01
  • Terminal Form: BALL
  • Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
  • Operating Supply Voltage: 1.5V
  • Number of Terminations: 256
  • Operating Supply Current: 3mA
  • Width: 17mm
  • Frequency: 80MHz
  • Operating Temperature: 0°C~85°C TJ
  • Core Processor: ARM? Cortex?-M3
  • Architecture: MCU, FPGA
  • Max Supply Voltage: 1.575V
  • Min Supply Voltage: 1.425V
  • Connectivity: EBI/EMI, I2C, SPI, UART/USART
  • Number of Gates: 60000
  • Number of Logic Elements/Cells: 660
  • Data Rate: 400 kbps
  • Primary Attributes: ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
  • RoHS Status: RoHS Compliant
  • Packaging: Tray
  • Published: 2015
  • Time@Peak Reflow Temperature-Max (s): 30
  • Terminal Pitch: 1mm
  • Terminal Position: BOTTOM
  • JESD-609 Code: e1
  • Supply Voltage: 1.5V
  • Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
  • Number of Pins: 256
  • Length: 17mm
  • Height Seated (Max): 1.7mm
  • Core Architecture: ARM
  • Peak Reflow Temperature (Cel): 250
  • RAM Size: 16kB
  • Peripherals: DMA, POR, WDT
  • Package / Case: 256-LBGA
  • Memory Size: 4.5kB
  • Interface: EBI/EMI, I2C, SPI, UART, USART
  • Flash Size: 128KB
  • Series: SmartFusion?
  • Base Part Number: A2F060M3E
  • Number of I/O: MCU - 26, FPGA - 66

Microsemi Corporation — Manufacturer Introduction

Microsemi Corporation
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services.

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