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  • Manufacturer No:
    XC3S200A-4FTG256I
  • Manufacturer:
  • Category:
    Embedded - FPGAs (Field Programmable Gate Array)
  • Datasheet:
    Get the PDF file
  • SKU:
    5172695
  • Description:
    Spartan®-3A XC3S200A 256-LBGA Surface Mount field programmable gate array 1.26V 36kB -40C~100C TJ
  • Quantity:
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Inventory:1076
  • Qty Unit Price price
  • 1 $62.866 $62.866
  • 10 $62.243 $622.43
  • 100 $61.626 $6162.6
  • 1000 $61.015 $61015
  • 10000 $60.41 $604100

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  • Manufacturer No:
    XC3S200A-4FTG256I
  • Manufacturer:
    Xilinx
  • Category:
    Embedded - FPGAs (Field Programmable Gate Array)
  • Datasheet:
    XC3S200A-4FTG256I
  • SKU:
    5172695
  • Description:
    Spartan®-3A XC3S200A 256-LBGA Surface Mount field programmable gate array 1.26V 36kB -40C~100C TJ

XC3S200A-4FTG256I Details

Spartan®-3A XC3S200A 256-LBGA Surface Mount field programmable gate array 1.26V 36kB -40C~100C TJ

XC3S200A-4FTG256I Specification Parameters

  • Part Status: Active
  • Mounting Type: Surface Mount
  • Speed Grade: 4
  • Factory Lead Time: 10 Weeks
  • Moisture Sensitivity Level (MSL): 3 (168 Hours)
  • REACH SVHC: Unknown
  • Max Operating Temperature: 100°C
  • Operating Temperature: -40°C~100°C TJ
  • Min Supply Voltage: 1.14V
  • Package / Case: 256-LBGA
  • Number of LABs/CLBs: 448
  • Number of Gates: 200000
  • Number of Logic Elements/Cells: 4032
  • RAM Size: 36kB
  • Supplier Device Package: 256-FTBGA (17x17)
  • RoHS Status: ROHS3 Compliant
  • Mount: Surface Mount
  • Packaging: Tray
  • Min Operating Temperature: -40°C
  • Published: 2007
  • Operating Supply Voltage: 1.2V
  • Number of Pins: 256
  • Voltage - Supply: 1.14V~1.26V
  • Max Supply Voltage: 1.26V
  • Number of I/O: 195
  • Number of Logic Blocks (LABs): 448
  • Total RAM Bits: 294912
  • Number of Macro Cells: 4032
  • Series: Spartan?-3A
  • Base Part Number: XC3S200A

Xilinx — Manufacturer Introduction

Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.

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